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Indium Corporation to Showcase Proven EV Products at productronica India
August 24, 2023 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at productronica India, September 13-15, 2023, in Bengalaru. A strong supporter of the Make in India campaign, Indium Corporation is committed to serving the region’s growing EV market.
“With our facility in Chennai, Indium Corporation is well positioned to support regional demand for consumer and infrastructure electronics, including EV manufacturing,” said Senior Country Sales Manager Damian Santhanasamy. “We look forward to serving the Indian electronics market, not only with our innovative materials, but by providing local technical support and expertise.”
With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature its Rel-ion™ suite of electrical, mechanical, and thermal solutions to reduce electric vehicle (EV) manufacturers’ time to market.
More than three million EVs are on the road with Indium Corporation’s reliable, scalable, and proven Rel-ion products. Rel-ion material solutions deliver reliability by:
- Eliminating non-wet opens and head-in-pillow defects
- Preventing dendritic growth by meeting stricter surface insulation resistance requirements
- Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
- Reducing hot spots-induced voiding through improved thermal efficiency
Some of the featured Rel-ion products include:
- Award-winning Durafuse® LT a novel solder paste alloy technology with highly versatile characteristics that enable it for energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
- The Indium8.9HF Solder Paste Series, an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
- InFORMS®, reinforced solder alloy fabrications, improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- Heat-Spring® solutions, ideal for TIM2 applications, are a compressible interface between a heat source and a heat-sink. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK.
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Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
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Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.