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IPC Day Romania: Build Electronics Better with Standards and Solutions, Conference Powered by FLEX
August 24, 2023 | IPCEstimated reading time: 1 minute
IPC Day Romania: Build Electronics Better with Standards and Solutions, Conference Powered by Flex, which will be held on Sep 27, 2023 at 12:00pm and Sep 28, 2023 at 6:00pm EEST, will provide a unique opportunity to learn about the latest advancements in electronics manufacturing, participate in industry discussions, and network with a community of professionals dedicated to building electronics better.
Presentation and panel discussions will feature industry experts in electronics reliability, e-mobility, medical meets 5G, education and training, and IPC leadership. The world-class lineup includes speakers and panelists from NASA, Stellantis, Bosch, FLEX, Indium, TTM Technologies, Viscom, Nokia, IPC, The Polytechnic University, and Vitesco. Complete agenda coming soon!
Topics include:
- Electronics Reliability
- Introduction to solder joint reliability standards & simulations,
- electronics reliability in space applications.
- E-mobility Reliability Panel
- Medical meets 5G
- Education and Training – University studies and IPC certification and training programs
- IPC opportunities to participate in standards development, educational opportunities, and events
Who should attend?
- Manufacturing, quality, and design engineers
- Members of Academia
- Senior and junior engineering students
- Specialist or Practitioner in Manufacturing
Location: Auditorium of the Library of the Polytechnical University
Bulevardul Vasile Pârvan 2
300073 Timisoara, Romania
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Brent Fischthal - Koh YoungSuggested Items
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.