Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
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IPC Day Romania: Build Electronics Better with Standards and Solutions, Conference Powered by FLEX
August 24, 2023 | IPCEstimated reading time: Less than a minute
IPC Day Romania: Build Electronics Better with Standards and Solutions, Conference Powered by Flex, which will be held on Sep 27, 2023 at 12:00pm and Sep 28, 2023 at 6:00pm EEST, will provide a unique opportunity to learn about the latest advancements in electronics manufacturing, participate in industry discussions, and network with a community of professionals dedicated to building electronics better.
Presentation and panel discussions will feature industry experts in electronics reliability, e-mobility, medical meets 5G, education and training, and IPC leadership. The world-class lineup includes speakers and panelists from NASA, Stellantis, Bosch, FLEX, Indium, TTM Technologies, Viscom, Nokia, IPC, The Polytechnic University, and Vitesco. Complete agenda coming soon!
Topics include:
- Electronics Reliability
- Introduction to solder joint reliability standards & simulations,
- electronics reliability in space applications.
- E-mobility Reliability Panel
- Medical meets 5G
- Education and Training – University studies and IPC certification and training programs
- IPC opportunities to participate in standards development, educational opportunities, and events
Who should attend?
- Manufacturing, quality, and design engineers
- Members of Academia
- Senior and junior engineering students
- Specialist or Practitioner in Manufacturing
Location: Auditorium of the Library of the Polytechnical University
Bulevardul Vasile Pârvan 2
300073 Timisoara, Romania
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