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Conecsus Metals Mexico to Exhibit Waste Recycling Solutions at SMTA Chihuahua Expo & Tech Forum
August 30, 2023 | Conecsus Metals MexicoEstimated reading time: Less than a minute
Conecsus Metals México, an innovative environmental technology and recycling company, will exhibit at the SMTA Chihuahua Expo & Tech Forum on Thursday, September 7, 2023, beginning at 11:00 AM, at the Sheraton Chihuahua Soberano, BARRANCA DEL COBRE 3211, Chihuahua, Chihuahua, México.
Conecsus Metals México will showcase a variety of metals waste recycling solutions. With solder waste reprocessing facilities located in Terrell, TX, USA, Conecsus LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as complex by-products that can be recovered from industries in North America as well as World Wide.
Conecsus representatives Yessica Romero, Regional Sales Manager, and Carolina Renteria, Customer Services Manager, will illustrate how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, and Silver, and converts them into usable metal products, paying its customers back for their metals waste. Conecsus is an ISO 14001 EMS-certified recycling company and a refiner of SMT solder/solder paste wastes and residues. The show offers free technical sessions, free lunch, and the opportunity to network with leading industry suppliers.
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Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Scrutinizing Solder Printing
09/10/2024 | Nolan Johnson, I-Connect007As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.
iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita
09/09/2024 | iNEMIiNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.
Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India
09/09/2024 | Indium CorporationIndium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.
Eutect Overcomes Panel Soldering Challenges with New Gripper
09/06/2024 | Eutect GmbHThe selective soldering of assemblies in panels is not a real challenge. However, if you need to solder relatively large panels with towering components, specialists like those at Eutect GmbH have to step up to the plate.