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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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Challenges in Modern PCB Design and Analysis
September 5, 2023 | Steve Watt, ZukenEstimated reading time: 1 minute

Navigating the complex landscape of modern PCB design presents numerous challenges for designers and the processes they use. Concerns about time to market, performance, system-level design, requirements, costs, and staffing are driving forces that shape the evolution of the modern PCB industry.
Zuken recognizes the need to address innovation in all areas of the design process while remaining responsive to customer-driven requirements. While we can make predictions about various challenges, concerns, and requirements, our customers play a vital role in shaping the company’s development direction. They have the benefit of being “in the trenches,” so to speak, on a daily basis, so they are the subject matter experts and can help identify gaps in our tools based on where their processes are heading.
System-level Analysis
The new era of electronic systems is characterized by increasing complexity. The demand for higher data rates, lower power consumption, and smaller form factors drive this surge in complexity. As a result, the challenges of managing signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) are also increasing.
To tackle these challenges, performing system-level SI, PI, and EMI analysis is imperative. This means the entire system must be considered, including different boards, cables, and other components. This comprehensive approach allows engineers to identify and address SI and PI problems before they lead to potential system failures. Engineers can proactively mitigate SI, PI, and EMI problems by delving into system-level analysis, which ensures robust system performance.
To read this entire article, which appeared in the August 2023 issue of Design007 Magazine, click here.
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Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
High-frequency EMC Noise in DC Circuits
05/29/2025 | Karen Burnham, EMC UnitedEMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.