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Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Challenges in Modern PCB Design and Analysis
September 5, 2023 | Steve Watt, ZukenEstimated reading time: 1 minute
Navigating the complex landscape of modern PCB design presents numerous challenges for designers and the processes they use. Concerns about time to market, performance, system-level design, requirements, costs, and staffing are driving forces that shape the evolution of the modern PCB industry.
Zuken recognizes the need to address innovation in all areas of the design process while remaining responsive to customer-driven requirements. While we can make predictions about various challenges, concerns, and requirements, our customers play a vital role in shaping the company’s development direction. They have the benefit of being “in the trenches,” so to speak, on a daily basis, so they are the subject matter experts and can help identify gaps in our tools based on where their processes are heading.
System-level Analysis
The new era of electronic systems is characterized by increasing complexity. The demand for higher data rates, lower power consumption, and smaller form factors drive this surge in complexity. As a result, the challenges of managing signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) are also increasing.
To tackle these challenges, performing system-level SI, PI, and EMI analysis is imperative. This means the entire system must be considered, including different boards, cables, and other components. This comprehensive approach allows engineers to identify and address SI and PI problems before they lead to potential system failures. Engineers can proactively mitigate SI, PI, and EMI problems by delving into system-level analysis, which ensures robust system performance.
To read this entire article, which appeared in the August 2023 issue of Design007 Magazine, click here.
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