-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
MIRTEC Showcases Cutting-Edge Inspection Technology at SMTA International 2023
September 5, 2023 | MIRTEC GmbHEstimated reading time: 1 minute
MIRTEC, ‘The Global Leader in Inspection Technology’, is excited to announce its participation in the highly anticipated SMTA International Exhibition, scheduled to take place at the Minneapolis Convention Center in Minnesota from October 10-11, 2023. MIRTEC will proudly showcase its groundbreaking MV-6 OMNI 3D AOI Series featuring the exclusive OMNI-VISION® 3D Inspection Technology in booth #1201.
Leading the Way in Innovation
MIRTEC will display its Award-Winning MV-6 OMNI 3D AOI Series at the SMTAI 2023. The MV-6 OMNI series features MIRTEC’s state-of-the-art OMNI-VISION® 3D Inspection Technology, which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC's revolutionary Digital 12 Projection BLUE Moiré 3D Technology. This innovative combination delivers unparalleled accuracy and performance.
Precision and Performance through Proprietary Technology
The proprietary Ultra-High Resolution CoaXPress Vision System, meticulously designed and manufactured by MIRTEC, stands as the cornerstone of the company's 3D inspection systems. Powered by MIRTEC's Digital 12 Projection Digital BLUE Moiré Technology, the MV-6 OMNI machines offer true 3D inspection, providing precise height measurement data crucial in detecting lifted component and lifted lead defects, as well as post-reflow solder volume. The fully equipped MV-6 OMNI machines are configured with four 10MP or 18MP Side-View Cameras, a Top-Down Camera, a Multi-Focus Programmable Z-Axis System, an Internal PCB Flipper Conveyor, and Multi-Function AOI/SPI Fusion Technology.
Empowering the Future with AI
MIRTEC’s Smart Factory Automation solution, ‘INTELLI-PRO’, is an AI based Software Suite specifically designed for the purpose of improving the performance and convenience of MIRTEC’s complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.
"We look forward to showcasing our Leading-Edge Inspection Solution at this year’s SMTAI Exhibition,” stated Brian D'Amico, President of MIRTEC’s North American Sales and Service Division. “We invite attendees to join us at this upcoming event to experience the future of Inspection Technology first-hand and to explore how MIRTEC can help them to achieve the highest levels of Quality, Efficiency and Profitability."
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.