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Book Excerpt: 'The Printed Circuit Designer's Guide to... Manufacturing Driven Design,' Chapter 4
September 12, 2023 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

Excerpt from: The Printed Circuit Designer's Guide to... Manufacturing Driven Design, Chapter 4—Concurrent and Intelligent DFM
Bridging the Gap
If Manufacturing Driven Design is to be considered as the eventual end goal of the larger product manufacturing process, it is worthwhile to consider where the current industry is in terms of adoption of this methodology. I spent a good deal of time in Chapter 3 specifically explaining what DFM is not. In this chapter, we will cover what, and where, DFM currently is. DFM has been evolving away from the rudimentary and manual selection Engineering Rules Files to an automated and intelligent means of assigning manufacturing process requirements based on design characteristics.
It could be suggested that DFM is meant to represent the manufacturers’ interpretations of the design requirements only from a process perspective. This may suggest that DFM should have been viewed as a transitional solution that is better off taken into consideration throughout the design process. Widespread technological adoption of MDD within the PCB industry has been rather cautious as a whole, especially when compared to similar fields which have already adopted an MDD approach. Many within the industry see the evolution of DFM as the end solution, instead of as a transitionary approach to manufacturing. Within late-stage DFM, there are several significant advancements that are now emerging which show promise in bridging the gap between Digital Rule Checks (DRCs) and MDD. These are the use of Concurrent DFM and Intelligent DFM.
Both concurrent and intelligent DFM complement each other within the typical workflow and represent the beginnings of a transition away from a classical DFM, allowing for an improved NPI process.
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09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
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Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).