-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
ViTrox Showcases Revolutionary Industry 4.0 Full Turnkey SMT PCBA Inspection Solutions at Productronica Germany 2023
September 13, 2023 | ViTroxEstimated reading time: 3 minutes

ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce that we will be participating in Productronica Germany, at Booth #A2.504, from 14th to 17th November 2023, in International Congress Center München (ICM), Munich, Germany.
This year, we will be showcasing our cutting-edge solutions, ranging from V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution, V810i Advanced 3D X-Ray Inspection (AXI) Solution, V9i Advanced Robotic Vision (ARV) Solution, and of course, our Industry 4.0 Manufacturing Intelligence Solutions - V-ONE.
The V310i 3D SPI is the key to ensuring SMT product quality, providing effortless programming while achieving excellent repeatability and accurate inspection results. Equipped with Ultra Smart Programming, users can instantly start inspection without manual parameter setup, making it user-friendly even for inexperienced operators. The V310i 3D SPI also enables precise solder bump measurement and extended height measurement using shadow-free fringe pattern technology, enhancing the maximum 3D rendering capabilities from 450µm to 1500µm. Another great piece of news to share with you is that our SPIs have successfully qualified for the IPC-CFX-2591 Qualified Products Listing (QPL).
Next in our line-up will be the V510i 3D AOI solution, which is well-implemented with in-depth Artificial Intelligence (A.I.) Smart Technologies. With A.I. Smart Programming, our AOI can reduce human dependency, rapidly improve the programming speed, and guarantee quality, accuracy, and consistency during inspections. Therefore, users will experience up to 4 times the speed of programming time, ultimately achieving a higher yield with lower operating costs. Another significant A.I. technology is the A.I. Assisted Defect Review (A.I. VVTS), designed to automate buy-off processes in repair stations and guarantee you over 90% judgement accuracy. Our V510i 3D AOI has also successfully qualified for the IPC-CFX-2591 Qualified Products Listing (QPL) and has received the mandatory IPC-CFX messages for classification. Read more about our V510i 3D AOI Solution.
The third solution will be our V810i S3 AXI Solution, innovated with an ergonomic design that saves production floor space, while boosting inspection speed by up to 30% with new machine geometry and scanning methods. ViTrox offers a new unique imaging and reconstruction method (H-reconstruction) to address challenging inspections of very heavily shaded components and non-uniformly shaded components. Equipped with A.I. integration, our AXIs have capabilities to detect defects of specific joint types, enhancing inspection accuracy. Plus our 3D AXI Solution has also achieved IPC-CFX-2591 QPL validation. Explore the groundbreaking V810i S3 AXI Solution today.
We will also be showcasing our award-winning V9i ARV Solution, revolutionising flexible inspections for conformal coating and final assembly inspections. Featuring a unique 6-axis COBOT design, it enables adjustable angle inspections up to 90°, guaranteeing convenience. With its Advanced Smart Learning Algorithm, V9i ARV detects various conformal coating defects and checks for screw, cosmetic, connector, and label defects in final assembly without requiring CAD information. Other than that, the solutions provide better traceability in the back-end assembly process compared to human manual inspection. Read more about our V9i ARV Solution’s capabilities in conformal coating inspection and final inspection.
Last but not least, the unveiling of our cutting-edge Industry 4.0 Manufacturing Intelligence Solutions - V-ONE, a Smart Manufacturing necessity in Machine-2-Machine (M2M) production. Among the powerful features housed in our V-ONE will be the A.I. VVTS, ONE View, and our Intelligent Control Tower. The A.I. VVTS tool seamlessly integrates with ViTrox's AOI and AXI systems, achieving over 90% A.I. coverage and high accuracy in defect detection, reducing the need for manual labour in inspections. We have also revolutionised the tracking and analysing of production process data with the latest ViTrox Database Statistical Process Control (VDSPC) 2.0. ONE View connects data from various inspection equipment, enabling real-time cross-referencing for enhanced production process oversight and quality assurance. The Intelligent Control Tower facilitates real-time data analysis across multiple production lines, offering customised production impact assessments to fine-tune critical production issues, ensuring optimised performance. With V-ONE, anyone can monitor the production status anytime, anywhere. Read more about the unique features available in our V-ONE: A.I. VVTS, ONE View, and Intelligent Control Tower.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.