-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Cadence Next-Gen AI-Driven OrCAD X Delivers Up to 5X Faster PCB Design with Cadence OnCloud
September 13, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes

Cadence Design Systems, Inc. announced the new Cadence OrCAD X Platform, a cloud-enabled system design solution that offers transformative improvements in ease of use, performance, automation and collaboration. The new OrCAD X Platform streamlines the system design process and empowers designers through cloud scalability and AI-powered placement automation technology, enabling up to 5X reduction in design turnaround time.
With significantly higher productivity enabled by cloud-connected capabilities—including data management, collaborative layout design and a new easy-to-use layout environment optimized for small and medium businesses—this next-generation platform includes everything in the OrCAD platform and more. Supercharged with powerful layout productivity improvements based on the Cadence Allegro® X Platform, it provides complete backward data compatibility with OrCAD and Allegro technologies.
The new OrCAD X platform provides the following benefits:
- Cloud-enabled: Improves productivity with real-time access to data management via the Cadence OnCloud Platform. Data storage and management through a cloud login enables a hybrid work environment across the desktop and the cloud, reducing infrastructure costs for the user.
- Ease of use: Optimized for small and medium businesses, the OrCAD X platform offers a new, easy-to-learn and easy-to-use PCB layout canvas while retaining the power of industry-proven engines. New cloud-based licensing options are available as well as many user-experience enhancements from installation through design. The dynamic creation of manufacturing documentation provides a real-time view of fabrication details throughout the entire design process.
- Faster turnaround time: Significantly enriched electrical constraints, performance improvements and integration with the broader Cadence system design and analysis portfolio enable faster time to market.
- Collaboration: Cloud-hosted collaboration allows multiple designers to work concurrently on the same layout design.
The OrCAD X platform can access automated placement through the Allegro X AI system, which enables transformative placement time reduction from days to minutes. Users can achieve these placement time reductions while simultaneously addressing signal integrity, power integrity and thermal design effects during placement, routing of critical signals and the generation of power planes.
“Cadence is committed to delivering optimal system design solutions that incorporate the power of generative AI and the cloud to enable the fastest turnaround times,” said Michael Jackson, corporate vice president of R&D in the Custom IC & PCB Group at Cadence. “The new OrCAD X platform will have a transformative impact, offering customers greater productivity through ease of use, cloud-enabled data management, AI-powered automation, improved engine performance and integration with Cadence’s system design and analysis product portfolio.”
The AI-based OrCAD X platform supports Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation. Customers can learn more about the OrCAD X platform at the PCB West 2023 conference and exhibition, September 19-22 in Santa Clara, Calif. or by visiting Cadence's website.
Suggested Items
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
WellPCB, OurPCB Launch Low-Cost PCB Assembly and Custom Cable Assembly Solutions
05/29/2025 | ACCESSWIREWellPCB and OurPCB, world leading PCB manufacturing service providers, announced today that they have officially launched new Low-Cost PCB Assembly Solutions and Custom Cable Assembly services to meet the needs of the electronics manufacturing industry for high cost performance and flexible customization.
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
05/29/2025 | SiemensSiemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
High-frequency EMC Noise in DC Circuits
05/29/2025 | Karen Burnham, EMC UnitedEMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.