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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Cadence Next-Gen AI-Driven OrCAD X Delivers Up to 5X Faster PCB Design with Cadence OnCloud
September 13, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes

Cadence Design Systems, Inc. announced the new Cadence OrCAD X Platform, a cloud-enabled system design solution that offers transformative improvements in ease of use, performance, automation and collaboration. The new OrCAD X Platform streamlines the system design process and empowers designers through cloud scalability and AI-powered placement automation technology, enabling up to 5X reduction in design turnaround time.
With significantly higher productivity enabled by cloud-connected capabilities—including data management, collaborative layout design and a new easy-to-use layout environment optimized for small and medium businesses—this next-generation platform includes everything in the OrCAD platform and more. Supercharged with powerful layout productivity improvements based on the Cadence Allegro® X Platform, it provides complete backward data compatibility with OrCAD and Allegro technologies.
The new OrCAD X platform provides the following benefits:
- Cloud-enabled: Improves productivity with real-time access to data management via the Cadence OnCloud Platform. Data storage and management through a cloud login enables a hybrid work environment across the desktop and the cloud, reducing infrastructure costs for the user.
- Ease of use: Optimized for small and medium businesses, the OrCAD X platform offers a new, easy-to-learn and easy-to-use PCB layout canvas while retaining the power of industry-proven engines. New cloud-based licensing options are available as well as many user-experience enhancements from installation through design. The dynamic creation of manufacturing documentation provides a real-time view of fabrication details throughout the entire design process.
- Faster turnaround time: Significantly enriched electrical constraints, performance improvements and integration with the broader Cadence system design and analysis portfolio enable faster time to market.
- Collaboration: Cloud-hosted collaboration allows multiple designers to work concurrently on the same layout design.
The OrCAD X platform can access automated placement through the Allegro X AI system, which enables transformative placement time reduction from days to minutes. Users can achieve these placement time reductions while simultaneously addressing signal integrity, power integrity and thermal design effects during placement, routing of critical signals and the generation of power planes.
“Cadence is committed to delivering optimal system design solutions that incorporate the power of generative AI and the cloud to enable the fastest turnaround times,” said Michael Jackson, corporate vice president of R&D in the Custom IC & PCB Group at Cadence. “The new OrCAD X platform will have a transformative impact, offering customers greater productivity through ease of use, cloud-enabled data management, AI-powered automation, improved engine performance and integration with Cadence’s system design and analysis product portfolio.”
The AI-based OrCAD X platform supports Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation. Customers can learn more about the OrCAD X platform at the PCB West 2023 conference and exhibition, September 19-22 in Santa Clara, Calif. or by visiting Cadence's website.
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Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.