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All Flex Solutions Installs New Inner Layer Factory

12/05/2023 | All Flex Solutions
All Flex Solutions has purchased and installed a new inner layer factory in their Rigid Flex Center of Excellence located in Minneapolis. This continues their investments in plants and technology to support customers’ needs for capability, speed and increased yield.

With Flex and Rigid-flex, Ask the Right Questions

10/26/2023 | Andy Shaughnessy, Design007 Magazine
I recently met with Tony Plemel, senior applications engineer with Flexible Circuit Technologies. In this interview, Tony discusses when flex designers need to break the rules, when they can’t break the rules, and why it’s so important for fabricators to ask designers the right questions to ensure a successful build.

IPC Releases IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

10/19/2023 | IPC
IPC has released IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards. This document is the base standard for addendums covering military, space, medical, and automotive requirements.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/13/2023 | Andy Shaughnessy, Design007 Magazine
In this week’s Top 5, we start with a conversation with Mike Soble, who explains why SEL and Chemcut have such a great partnership. We have a review of SMTA International, which took place this week in Minneapolis. We also have a conversation with the design team at Monsoon Solutions; they explain how they geared their documentation process to the requirements of IPC standards. Mike Morando explains how to qualify your rigid-flex manufacturer. And we have an announcement about the IPC Checklist, a very useful document that I-Connect007 recently published.

Insulectro Flex Materials Showcase Offers Tips for Technologists

10/13/2023 | Andy Shaughnessy and Tobey Marsicovetere, I-Connect007
Insulectro continues its drive to educate PCB designers about the ins and outs of advanced flex materials. On Sept. 19 the company hosted an all-day seminar on flexible and printed electronic materials at its San Jose, Calif., facility.
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