-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
PCB West Review: EDA Tool Companies Finally Embrace AI
September 21, 2023 | Andy Shaughnessy, I-Connect007Estimated reading time: 1 minute
The weather couldn’t have been better for PCB West, and PCB designers and manufacturers packed the show floor for much of the exhibition on Wednesday, Sept. 20 in Santa Clara, California. The show floor was sold out, and it was great seeing old friends and meeting new ones.
If there was one unifying topic for this show, it would have to be the advent of artificial intelligence in EDA tools. Some PCB designers are apprehensive about AI, fearing that it will take away their jobs. But that doesn’t seem to be the case, according to PCB007 Editor Nolan Johnson, who attended the Wednesday afternoon panel, “AI in Electronics: What Can We Expect?”
Nolan shared the following observations from panelist Sebastian Schaal of Luminous: “AI in PCB today is at a level similar to assembly language for software developers. Higher-level programming tools did not take away jobs; they just made us much more effective.”
On Tuesday, Zuken announced AIPR for its CR-8000 PCB design tools. Kyle Miller, PhD, the scientist behind the development of the tool’s AI, also took part in the AI panel. Right now, Zuken’s AI will only work with CR-8000, but Kyle expects their tool to be able to read in IPC-2581 data soon.
PCB West was a definite success. Let’s hope this marks a harbinger for the rest of the trade show season.
Suggested Items
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
Global Semiconductor Sales Increase 18.8% in Q1 2025 Compared to Q1 2024; March 2025 Sales up 1.8% MoM
05/06/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $167.7 billion for the first quarter of 2025, an increase of 18.8% compared to the first quarter of 2024 but 2.8% less than the fourth quarter of 2024.
KYZEN’s Adam Klett to Present at 2025 SMTA Electronics in Harsh Environments Conference
05/05/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced today that Director of Science Adam Klett, PhD will present during the technical conference at the 2025 SMTA Electronics in Harsh Environments Conference.
Airbus Reports Q1 2025 Results
05/05/2025 | AirbusConsolidated revenues increased 6% year-on-year to € 13.5 billion (Q1 2024: € 12.8 billion). A total of 136 commercial aircraft were delivered (Q1 2024: 142 aircraft), comprising 17 A220s, 106 A320 Family, 4 A330s and 9 A350s.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.