Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
Flexible Thinking: Musings on High Density Interconnections
Global PCB Connections: Mission Critical—Communication Between PCB Designers and Fabricators
GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding
September 26, 2023 | GlobalFoundriesEstimated reading time: 1 minute
GlobalFoundries (GF) announced it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce. The submitted applications are for capacity expansion and modernization of GF’s U.S. manufacturing facilities.
“As the leading manufacturer of essential semiconductors for the U.S. government, and a vital supplier to the automotive, aerospace and defense, IoT and other markets, GF has submitted our applications to the CHIPS Program Office to participate in the federal grants and investment tax credits enabled by the U.S. CHIPS and Science Act,” said Steven Grasso, senior director of global government affairs at GF. “This federal support is critical for GF to continue growing its U.S. manufacturing footprint, strengthening U.S economic security, supply chain resiliency, and national defense.”
GF is a longstanding partner to the U.S. government and the leading supplier of securely manufactured essential chips for the U.S. aerospace and defense industry. GF-made essential chips are driving innovation, increasing power efficiency, and minimizing the total cost of ownership for products in high-growth markets including automotive, data center, IoT, aerospace and defense, and smart mobile.
Share on:
Suggested Items
Biden-Harris Administration to Invest $825 Million in First CHIPS for America R&D Facility
11/01/2024 | U.S. Department of CommerceThe Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility. The CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), is expected to operate within NY CREATES’ Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it.
Biden-Harris Administration Designates Albany NanoTech as First CHIPS for America R&D Flagship
10/31/2024 | U.S. Department of CommerceThe Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility.
NY Lands First National Semiconductor Facility
10/31/2024 | Governor Kathy HochulGovernor Kathy Hochul celebrated the designation of NY CREATES’ Albany NanoTech Complex as the location of the CHIPS for America EUV Accelerator, an NSTC facility.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
SIA Applauds CHIPS Incentives for Hemlock Manufacturing Expansion in Michigan
10/22/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Hemlock Semiconductor (HSC).