-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Unlocking Synergies
September 26, 2023 | Miles Moreau, KICEstimated reading time: 1 minute

The U.S. Chips Act Propels Collaboration Between Semiconductor Manufacturers and Equipment Suppliers
Introduction: Embracing Collaboration in Semiconductor Manufacturing
In today's rapidly evolving world, the semiconductor industry stands as a driving force across economies and industries, propelling progress through technological advancements. The U.S. CHIPS Act emerges as a game-changing legislation aimed at redefining America's semiconductor manufacturing prowess. The Act sets forth a clear mission: bolster domestic chip production, reinforce national security, and stimulate economic growth.
As the echoes of the U.S. CHIPS Act ripple through the industry, a pivotal juncture arises for both semiconductor manufacturers and equipment suppliers. This legislation has captivated the attention of industry leaders, government bodies, and astute investors. Industry giants like Intel, TSMC, Samsung, and GlobalFoundries have committed substantial investments to U.S. semiconductor manufacturing and advanced packaging. These visionary leaders are primed to reshape the landscape of chip production on American soil.
Seizing Opportunities: The Synergy of Collaboration
With the U.S. CHIPS Act heralding a new era, semiconductor manufacturers find themselves at a crossroads. This juncture holds both opportunities and the potential for transformation, where stronger and closer collaboration between manufacturers and equipment suppliers emerges as a promising path forward. Along with the investment and commitment of the global semiconductor behemoths, suppliers like KIC, global leaders in soldering and curing automated thermal process metrology solutions, are setting a visionary path lit by the bright lights of innovation.
Navigating the Landscape for Semiconductor Manufacturers
- Innovation takes the lead
- Powering progress through collaboration
- Championing sustainability
- Nurturing skilled talents
- The art of adaptability
To continue reading Miles' insights into the five aforementioned topics, turn to the September 2023 issue of SMT007 Magazine.
Miles Moreau is general manager at KIC, kicthermal.com, a solution provider for advanced packaging and SMT assembly. You can contact him at mmoreau@kicmail.com com or connect on LinkedIn at linkedin.com/in/milesmoreau.
Suggested Items
German Government Issues Final Funding Approval For New Infineon Fab In Dresden
05/08/2025 | InfineonInfineon Technologies AG has received final approval for the funding of its new plant in Dresden (Smart Power Fab) from the German Federal Ministry for Economic Affairs.
Jenoptik Fab Officially Inaugurated in Dresden
05/07/2025 | JenoptikJenoptik manufactures micro-optics for the semiconductor equipment industry in a state-of-the-art production environment.
StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA
05/07/2025 | StratEdgeStratEdge Corporation will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech.
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
Global Semiconductor Sales Increase 18.8% in Q1 2025 Compared to Q1 2024; March 2025 Sales up 1.8% MoM
05/06/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $167.7 billion for the first quarter of 2025, an increase of 18.8% compared to the first quarter of 2024 but 2.8% less than the fourth quarter of 2024.