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Valeo, Zuken Join Forces to Redefine Automotive Electronic Design

05/28/2026 | Zuken
Valeo, a global leader in mobility technologies, and Zuken, a pioneer in Electronic Design Automation (EDA) software, announce a major strategic partnership. In their joint "Zuken Valeo InnoLab" program, the two companies will create the most advanced and open AI-assisted electronic design platform on the market.

What Heterogeneous Integration Means for EMS Providers

05/14/2026 | Nolan Johnson, I-Connect007
Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.

NFC Forum Publishes Its Latest Technology Roadmap

02/03/2026 | BUSINESS WIRE
NFC Forum, the global standards body for Near Field Communication (NFC) technology, has announced its latest roadmap for the development of NFC Forum Standards and its corresponding technical capabilities.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/20/2025 | Andy Shaughnessy, I-Connect007
It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.

Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award

05/27/2025 | Promex
Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO Richard (Dick) Otte  has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging Society (EPS).
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