-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Quantum Dots Revolutionizing Image Sensors, Reports IDTechEx
October 23, 2023 | PRNewswireEstimated reading time: 3 minutes
Quantum dots (QDs) could potentially be targeting the huge consumer electronics application via its adoption in image sensors, apart from existing industrial applications. IDTechEx has published its view on the global quantum dot markets and enabling technologies in their report "Quantum Dot Materials and Technologies 2024-2034: Trends, Markets, Applications".
QDs were first discovered in 1980. They are semiconductor nanocrystals in the range of 2-10 nanometers (10-50 atoms) with size-tunable features. They exhibit quantum confinement effects due to their nanoscale dimensions, leading to remarkable optical and electrical characteristics. Both QD's photoluminescent and electroluminescent features can be potentially applied in various applications with different levels of commercial readiness. Quantum dot features can be adjusted by particle size, material, and composition. QD materials such as Cd-based, In-based, PbS, perovskites, as well as emerging CuInS2, InAs, and ZnTeSe QDs have varied bandgap and thus absorption and emission spectra. This fine-tuning ability has resulted in quantum dots' significant application potential, notably in displays, image sensors, photovoltaics, lighting, and various other use cases.
QDs are well known for their existing adoption in display applications. It is an emerging application to have QDs applied in image sensors, which are found in digital cameras, smartphones, and countless other devices, responsible for capturing and converting light into electronic signals that ultimately form images.
As the most widely used semiconductor material, silicon is an excellent choice for visible photodetectors. However, even longer wavelengths, such as near-infrared (NIR) or short-wave infrared (SWIR), may be required depending on the application. For NIR and SWIR sensing, especially above 1100nm, which are beyond silicon's ability, silicon Read-Out Integrated Circuit (ROIC) is still utilized while alternative semiconductors need to be pursued for the photodetectors. The combination of the silicon ROIC and photodetector with heterogeneous materials can be achievable by three possible routes.
The incumbent III-V image sensor is fabricated by the so-called 'heterogeneous hybridization' process, which applies to examples including indium gallium arsenide (InGaAs) and HgCdTe, etc. The alternative fabrication method is via monolithic growth of photodetector (such as germanium) on silicon ROIC.
QD and other solution processible materials can overcome the integration challenge of inorganic photodetector systems such as GaAs. This is because they can be applied directly onto the ROIC circuit via monolithic deposition.
Lead sulfide (PbS) QDs offer the advantage of tunability across an extensive spectrum of wavelengths, making them suitable for NIR or SWIR sensing applications. An intriguing possibility arises as they can be combined with a silicon ROIC to form a hybrid QD-Si NIR/SWIR image sensor. In this case, the sensing element can be arranged as a photodiode, photoconductor, or phototransistor.
This innovative integration presents a potential pathway towards achieving high-resolution small-pixel silicon-based NIR/SWIR sensors, eliminating the necessity for expensive and complicated heterogeneous hybridization of InGaAs sensors with Si ROIC. The low-cost hybrid QD-based image sensors can not only target applications traditionally realized by InGaAs SWIR image sensors but also help to reach new applications.
With the first generation of products already on the market and giants also getting involved in this area, the promise of this technology remains strong. This report explores hybrid QD-Si image sensors that can simultaneously achieve high resolution, low pixel pitch, and global shutter with potentially low costs. Technology analysis and player introductions are provided as well.
IDTechEx Research has been deeply engaged in the exploration of quantum dot technologies and markets since 2013. Throughout this period, IDTechEx has maintained a steadfast commitment to staying at the forefront of the latest research advancements and market trends. This has been achieved through an extensive interview program, direct interactions with companies, and active participation in relevant conferences and events.
Furthermore, IDTechEx Research has engaged closely with many of its clients, enabling a comprehensive grasp of their requirements. This collaboration has facilitated the provision of valuable insights into both the technological landscape and the dynamics of the market. Countless clients have benefited from this engagement, receiving strategic guidance for navigating the complexities of quantum dot technology innovation and commercialization.
Drawing from over two decades of experience in the analysis of advanced electronic materials and devices, IDTechEx Research has refined its expertise in evaluating emerging technologies. This extensive history provides a vantage point from which to understand the trajectories of various technologies, encompassing both their successes and setbacks.
This gives IDTechEx a uniquely experienced eye when it comes to analyzing emerging electronic material technologies. This is crucial because it helps us establish a realistic market and technology roadmap that reflects the true potential of the technology based on its intrinsic characteristics and the true level of technical and commercial challenges that it faces.
Suggested Items
Discovery Opens Doors for Cheaper and Quicker Battery Manufacturing
04/23/2025 | PNNLThe discovery centers on sublimation, a commonly known process whereby under the right conditions, a solid turns directly into a vapor. Sublimation is what creates the tail of a comet as it flies by the sun. As the comet’s icy shell heats up, the ice instantly becomes vapor, instead of first melting into liquid water.
Cybord Unveils ShieldScan, a Visual-AI PCBA Inspection Solution Ensuring Cyber-Physical Security and Supply Chain Integrity
04/23/2025 | PRNewswireCybord, the leading provider of advanced AI-powered electronic component analytics, announces the launch of ShieldScan, an advanced visual-AI printed circuit board assembly (PCBA) inspection solution that delivers unprecedented visibility and security in electronics manufacturing. ShieldScan automates full PCBA mapping, detects anomalies in real time, and ensures 100% board integrity, protecting manufacturers from supply chain tampering and security threats.
CONFIDEE: Guiding You Through Tariff Uncertainty
04/23/2025 | CONFIDEEThe current tariff landscape presents significant challenges for businesses, with shifting trade policies and increased duties impacting supply chains and overall costs. Navigating these complexities requires agility and strategic sourcing.
CACI Wins Fourth Edison Award for CrossBeam, an American-made Optical Communications Terminal
04/22/2025 | CACI International Inc.CACI International Inc announced that it has been awarded a prestigious bronze Edison Award™ for CrossBeam®, the first and only American-made, Space Development Agency-compliant optical communications terminal (OCT) that provides the U.S. government with reliable data communications for long-distance crosslink applications, from space to the warfighter and back.
Yamaha Boosts YRi-V AOI Productivity with 3D Component Update
04/22/2025 | Yamaha RoboticsYamaha Robotics Europe SMT Section has introduced instantaneous 3D component update, included with the latest software release for YRi-V automatic optical inspection (AOI) systems, letting users optimise inspection programs without stopping production.