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UHDI Fundamentals: UHDI Drives Unique IoT Innovation in Farming
April 22, 2025 | Anaya Vardya, American Standard CircuitsEstimated reading time: 1 minute
The combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications.
The typical discussions around UHDI focus on our standard electronics industry market segments like milaero, medical, consumer electronics, etc. IoT is all about machines talking to other machines, machine learning, and artificial intelligence, but again, typically applied in our PCB and assembly operations. The combination of UHDI and IoT is now exploding outside the electronics manufacturing industry, and the following two examples illustrate unexpected applications in farming.
The first is HerdDogg, a company that specializes in smart livestock tracking solutions using IoT technologies powered by UHDI engines. HerdDogg’s system is designed to provide real-time insights into herd health, location, behavior, and environmental conditions. The company makes lightweight sensors that are attached to the ears of herd animals to collect herd data and transmit it to the cloud, where it can then be accessed via the company’s app. The company also offers a drone that taps into the GPS location of herd animals so farmers and ranchers can oversee their herds remotely.
These wearable devices contain accelerometers to detect movement patterns and behaviors, temperature sensors to monitor animal health, Bluetooth Low Energy (BLE) transmitters (hardware transmitters), and low-power UHDI PCB technology to achieve compact, reliable functionality and high-speed data transmission. UHDI contributes compact, lightweight DoggTags, power efficiency and battery life, durability in outdoor environments, and integration of sensors, transmitters, and battery management in a tiny form factor.
To read the entire article, which originally appeared in the April 2025 issue of Design007 Magazine, click here.
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SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.
Sustainability Takes Center Stage in ‘On the Line With… Isola’ Podcast, Episode 3
03/25/2026 | I-Connect007I-Connect007 announces the release of Episode 3 of the podcast series On the Line With…, titled “The Green Circuit—Sustainability in PCB Manufacturing.” In this installment of PCB Materials: The Backbone and Future of Electronics, host Marcy LaRont speaks with Isola CTO Kirk Thompson about the growing role sustainability is playing in shaping the next generation of PCB materials and manufacturing processes.
IC Substrates vs. UHDI: The Future of Interconnect
03/15/2026 | Marcy LaRont, I-Connect007Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.
Companion Guide to Popular UHDI Podcast Series Now Available for Download
03/23/2026 | I-Connect007The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB design and manufacturing. As trace widths shrink from 25 microns toward 5 microns, UHDI enables finer geometries, tighter impedance control, improved RF performance, and reduced layer counts.