Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
Beyond Design: The Fundamental Structure of Spectral Integrity
The Shaughnessy Report: Watt About Power Integrity?
UHDI Fundamentals: UHDI Drives Unique IoT Innovation in Farming
April 22, 2025 | Anaya Vardya, American Standard CircuitsEstimated reading time: 1 minute
The combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications.
The typical discussions around UHDI focus on our standard electronics industry market segments like milaero, medical, consumer electronics, etc. IoT is all about machines talking to other machines, machine learning, and artificial intelligence, but again, typically applied in our PCB and assembly operations. The combination of UHDI and IoT is now exploding outside the electronics manufacturing industry, and the following two examples illustrate unexpected applications in farming.
The first is HerdDogg, a company that specializes in smart livestock tracking solutions using IoT technologies powered by UHDI engines. HerdDogg’s system is designed to provide real-time insights into herd health, location, behavior, and environmental conditions. The company makes lightweight sensors that are attached to the ears of herd animals to collect herd data and transmit it to the cloud, where it can then be accessed via the company’s app. The company also offers a drone that taps into the GPS location of herd animals so farmers and ranchers can oversee their herds remotely.
These wearable devices contain accelerometers to detect movement patterns and behaviors, temperature sensors to monitor animal health, Bluetooth Low Energy (BLE) transmitters (hardware transmitters), and low-power UHDI PCB technology to achieve compact, reliable functionality and high-speed data transmission. UHDI contributes compact, lightweight DoggTags, power efficiency and battery life, durability in outdoor environments, and integration of sensors, transmitters, and battery management in a tiny form factor.
To read the entire article, which originally appeared in the April 2025 issue of Design007 Magazine, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.