Beyond Design: Slaying Signal Integrity Villains
Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
UHDI Fundamentals: Ultra HDI Pushes PCB Manufacturing Capabilities
October 26, 2023 | Anaya Vardya, American Standard CircuitsEstimated reading time: 1 minute
Ultra high-density interconnect (UHDI) is a term used in the electronics industry to describe a cutting-edge technology that pushes the limits of fabrication capabilities for printed circuit boards (PCBs) and semiconductor devices. UHDI represents an advancement in miniaturization and integration, allowing for the creation of electronic components and systems with extremely high levels of functionality in a smaller footprint. UHDIs are sub-1-mil (0.001") line widths and spaces, which necessitate that we change the unit of measurement from mils to microns. For reference, a 1-mil trace is 25 microns. In general terms, UHDI refers to traces and spaces on a printed circuit board that are sub-25 micron. As electronics continue to shrink, so does the printed circuit board, not only in the X-axis, but also the Y-axis. Designers are challenged with reducing the form factor as well as the thickness of printed circuit boards to meet these demands. This is where UHDI comes in.
With every major advancement in technology comes manufacturing challenges. UHDI is not just a major change, it is a quantum leap in technology. It represents a change in the fundamental method of manufacturing printed circuit boards, moving from the traditional subtractive process to an additive one. UHDI technology requires not only new manufacturing methods, but new manufacturing equipment, chemistry, materials, and inspection capabilities. While there are some crossover processes, it is definitely not a plug-and-play implementation. PCB manufacturers that want to take on the challenge of producing ultra HDI boards will need to assess the more stringent requirements with regard to equipment and their manufacturing environment.
To read this entire article, which appeared in the October 2023 issue of Design007 Magazine, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.