Beyond Design: Does Current Deliver the Energy in a Circuit?
Flexible Thinking: Mechatronics in a Flex WorldUHDI Fundamentals: Ultra HDI Pushes PCB Manufacturing Capabilities
October 26, 2023 | Anaya Vardya, American Standard CircuitsEstimated reading time: 1 minute
Ultra high-density interconnect (UHDI) is a term used in the electronics industry to describe a cutting-edge technology that pushes the limits of fabrication capabilities for printed circuit boards (PCBs) and semiconductor devices. UHDI represents an advancement in miniaturization and integration, allowing for the creation of electronic components and systems with extremely high levels of functionality in a smaller footprint. UHDIs are sub-1-mil (0.001") line widths and spaces, which necessitate that we change the unit of measurement from mils to microns. For reference, a 1-mil trace is 25 microns. In general terms, UHDI refers to traces and spaces on a printed circuit board that are sub-25 micron. As electronics continue to shrink, so does the printed circuit board, not only in the X-axis, but also the Y-axis. Designers are challenged with reducing the form factor as well as the thickness of printed circuit boards to meet these demands. This is where UHDI comes in.
With every major advancement in technology comes manufacturing challenges. UHDI is not just a major change, it is a quantum leap in technology. It represents a change in the fundamental method of manufacturing printed circuit boards, moving from the traditional subtractive process to an additive one. UHDI technology requires not only new manufacturing methods, but new manufacturing equipment, chemistry, materials, and inspection capabilities. While there are some crossover processes, it is definitely not a plug-and-play implementation. PCB manufacturers that want to take on the challenge of producing ultra HDI boards will need to assess the more stringent requirements with regard to equipment and their manufacturing environment.
To read this entire article, which appeared in the October 2023 issue of Design007 Magazine, click here.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/19/2024 | Andy Shaughnessy, PCBDesign007Are you ready for the weekend? Fin de semana? I think we all are! In this week’s roundup, we have one article on what it takes to thrive in the industry today, as well as an interview that discusses one student’s drive to succeed as a PCB designer. We also have an article by our newest columnist, Tom Yang, who introduces us to his family-owned PCB company. Columnist Hanna Grace brings us an interview with her mentor, and Anaya Vardya continues his UHDI coverage with an article that explains UHDI’s use in the RF/microwave arena.
UHDI Fundamentals: UHDI for RF Microwave Applications
07/16/2024 | Anaya Vardya, American Standard CircuitsUltra high-density interconnect (UHDI) technology has significant potential for RF (radio frequency) microwave applications. Its advantages lie in its ability to provide high-density routing and integration, which are crucial for complex RF circuits. Here are three key UHDI benefits in RF microwave applications:
UHDI Fundamentals: UHDI Applications for Medical Devices
07/03/2024 | Anaya Vardya, American Standard CircuitsUltra high-density interconnect (UHDI) technology typically refers to advanced printed circuit board (PCB) manufacturing techniques that allow for a higher density of electronic components and interconnections within a smaller area. While not directly related to medical applications on its own, UHDI technology can indirectly benefit various medical devices and equipment by enabling smaller, more compact designs with increased functionality and performance.
UHDI Fundamentals: UHDI Applications for Wearable Electronics
06/03/2024 | Anaya Vardya, American Standard CircuitsWearable electronics is a type of technology that can be worn on the body and often integrated into clothing or accessories. These devices typically offer functionalities beyond traditional clothing, such as monitoring health metrics, providing notifications, or enhancing communication. Ultra high density interconnect (UHDI) has several potential applications in wearable electronics, primarily in enhancing visual experiences, data analysis, and communication.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.