Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’
Global Sourcing Spotlight: The Global Quality Gap—Why Consistency Wins the Contract
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
I don’t know everything, but I know one thing: This job is never boring. We publish three magazines and send out 32 newsletters each month, not to mention our e-books, so there really is no chance to get bored here. From an operational standpoint, I’m usually doing something different every day. And there’s always something new happening in PCB design and manufacturing.
Here’s just a sample of what we’ve published online in the last week: an article on zero liquid discharge technology, an interview with a flex fabricator about avoiding DFM issues, a feature on the use of AI in smart assembly processes, a news item about investment in advanced substrate development in the U.S., and a story about one woman’s journey in electronics, starting when she learned to solder at 11 years old.
Yes, there’s always something new in our publications. In the next month, we’ll be covering productronica in Munich. See you on the road!
Reducing Waste Makes Good Business Sense
Published October 24
A lot of people, myself included, used to look at reducing discharge as something with no value-add. Turns out we were wrong. Mike Brask and Alex Stepinski explain how Alex’s zero liquid-discharge (ZLD) process eliminates discharge and increases efficiency—while keeping the state and local regulators happy as well. We can expect to see more companies embrace zero-discharge technology.
With Flex and Rigid-flex, Ask the Right Questions
Published October 26
We have a great interview with Tony Plemel of Flexible Circuit Technologies. A lot can go wrong with a flex order from a new customer, but a little pre-planning goes a long way. Tony points out the need for fabricators to ask flex customers the right questions, when designers should break the rules, and when they absolutely can’t violate design rules.
Collaborating to Develop AI-powered Smart Assembly Processes
Published October 25
There’s been a lot of news around artificial intelligence (AI) this year. But as Koh Young’s Brent Fischthal explains, it may behoove you to collaborate with another organization in order to put AI to work in your company. Brent discusses Koh Young’s partnership with Binghamton University’s Smart Electronics Manufacturing Laboratory, and some of the results of this alliance.
MEDC Incentivizes Calumet Electronics $7.5M to Help Build DoD Technology, Upskill Workers
Published October 24
The CHIPS Act takes aim at the lack of advanced substrate development in the U.S., and Calumet Electronics is stepping up to the plate, with the help of $7.5 million from the Michigan Economic Development Corporation. The company plans to build a 60,000 square-foot advanced substrate facility at their Calumet, Michigan location, with a total investment of $51 million.
Brandy Tharp: A Passion For Helping Others
Published October 26
When you were 11, did you know how to solder? Brandy Tharp did. In this IPC Community article, Brandy recounts how her early interest in technology lead her away from her original dream of being a high school math teacher, and into a career as director of education and master trainer for IPC.
