The Chemical Connection: The Practice of Doing Business in Foreign Lands
It’s Only Common Sense: Pricing PCBs? It’s All in Their Heads
Punching Out: Entrepreneurship Through Acquisition Buyers for PCB/EMS Shops
ITW EAE MPM Introduces Edison II ACT Stencil Printer for Factory Automation
October 30, 2023 | ITW EAEEstimated reading time: 1 minute
MPM® announces the new Edison™ II ACT stencil printer a simple to use, easy to adopt and scalable solution for automation. The MPM® Edison™ II ACT is integrated with automated changeover technology that is fast and consistent with reduced operator requirement resulting in error-free changeover, and increased yield and throughput.
The MPM® Edison™ II ACT is the industry’s most accurate printer in the market with advanced technology needed for ultra-fine pitch and micro aperture printing processes. This makes it ideally suited for advanced semiconductor stencil printing applications. The MPM® Edison™ II ACT has a proven print process capability greater than 2 Cpk for 0201 metric components. With a built-in ±8 micron machine alignment, and ±15 micron wet print accuracy (≥2 Cpk @ 6 sigma, Edison's wet print accuracy is 25% better than the next best printers.
MPM® Edison™ II ACT has a transfer efficiency that exceeds requirements for the smallest apertures. A single high precision load-cell with closed-loop pressure control and motor driven system enable precise and consistent squeegee force control across the entire print stroke in both directions, which helps improve yields. Innovative machine design achieves ultra-tight coplanarity between stencil and substrate enabling yield improvement for ultra-thin stencil printing.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
CACI Wins Fourth Edison Award for CrossBeam, an American-made Optical Communications Terminal
04/22/2025 | CACI International Inc.CACI International Inc announced that it has been awarded a prestigious bronze Edison Award™ for CrossBeam®, the first and only American-made, Space Development Agency-compliant optical communications terminal (OCT) that provides the U.S. government with reliable data communications for long-distance crosslink applications, from space to the warfighter and back.
DuPont Ikonic 9000 CMP Pads Win 2025 Edison Award
04/09/2025 | DuPontDuPont announced that its Ikonic™ 9000 series of polishing pads for chemical mechanical planarization (CMP) was awarded a 2025 Bronze Edison Award™ in the AI-driven advancements category.
Samsung Acquires Sonio; Strengthens Position in Cutting-Edge Medical Devices
05/10/2024 | SamsungSamsung Medison, a global medical equipment company and an affiliate of Samsung Electronics, today announced it has signed an agreement to acquire 100% of the shares of Sonio SAS, a fetal ultrasound AI software company.
DuPont Wins Four 2022 Edison Awards, Highlighting Innovative Technologies
04/25/2022 | PRNewswireDuPont is proud to announce that four of its innovative, breakthrough technologies were recognized with the prestigious 2022 Edison Award.
ITW EAE Announces New SECS/GEM Communication Package for MPM Edison Stencil Printer
01/25/2021 | ITW EAEITW EAE announces a new SECS/GEM communication package for the MPM® Edison™ Printer. SECS/GEM is a semiconductor market communication standard that provides a common interface between manufacturing equipment. The Edison package collects and logs process data which can be used to optimize the production line.