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Reassessing Surface Finish Performance for Next-gen Technology, Part 2

03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.
The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.

Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China

02/28/2024 | Indium Corporation
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.

UL-Authorization Received for Ventec High-CTI, Halogen Free FR15.1 Substrates VT-447C and VT-441C

02/27/2024 | Ventec
Ventec International Group Co., Ltd. , is pleased to announce that UL’s evaluation of two of Ventec’s halogen-free, phenolic cured high-CTI substrates have received authorization to apply the UL mark.

iNEMI End-of-Project Webinar: Connector Reliability Test Recommendations

02/23/2024 | iNEMI
The iNEMI Connector Reliability Test Recommendations Project, Phases 1 through 3, addressed the need for a standardized reliability evaluation method for connectors.

 ROCKA Solutions' Justin Worden to Present at SMTA Dallas Expo & Tech Forum:

02/23/2024 |  ROCKA Solutions
 ROCKA Solutions is excited to announce that Justin Worden, Vice President of Sales & Marketing, will present at the upcoming SMTA Dallas Expo & Tech Forum. The event is scheduled to take place Tuesday, March 19, 2024 at the Plano Event Center.
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