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Cadence, Autodesk Collaborate on Smart Product DesignNovember 14, 2023 | Cadence Design Systems, Inc.
Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced a collaboration with Autodesk to provide solutions that accelerate intelligent system design leveraging Autodesk Fusion and Cadence® PCB solutions. This new integration offers customers seamless collaboration between electronic and mechanical engineering to accelerate the development of smart products through efficient co-design.
Electrical and mechanical engineers face increased pressure to produce products with fewer revisions, making efficient collaboration key to delivering smart products to market on time. Current manual design data methods require users to exchange files that can differ from design intent, resulting in errors, unnecessary re-work and costly delays.
To address these challenges, the companies have integrated Autodesk Fusion with Cadence’s Allegro® X and OrCAD® X platforms into a solution that enables seamless bi-directional communication between PCB designers and mechanical engineers. The platform integration enables companies to take full advantage of cloud-based mechanical design and generative AI/ML PCB design, while fully leveraging multiphysics analysis for power, thermal, electromagnetics and more.
“The electronics industry is being disrupted on multiple fronts including supply chain challenges and rapidly accelerating product complexity,” said Tom Beckley, senior vice president, Cadence. “Our partnership with Autodesk provides access to leading-edge technology for electronic design integrated with Autodesk’s leading cloud-enabled, connected mechanical CAD solutions.”
“Our partnership with Cadence powers a seamless collaboration between mechanical and electronics design, putting customers at the center,” said Jeff Kinder, executive vice president, Autodesk. “Manufacturers need to bring more complex products to the market faster – all while juggling distributed teams, supply chain disruptions, and costs. This integration further extends Autodesk’s vision to connect end-to-end design and make processes in manufacturing.”
The AI-based Allegro X and OrCAD X platforms support Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation.
RS Group Selects Siemens' EDA Simulation Technology for New Cloud Native DesignSpark Circuit Simulator12/05/2023 | PRNewswire
Siemens Digital Industries Software announced that the RS Group plc, a global provider of product and service solutions to more than 1.1 million industrial customers, has selected Siemens as its strategic electronic design automation (EDA) provider for its new, cloud native, DesignSpark Circuit Simulator tool – empowering users to streamline the design process.
EMA Design Automation to Spin-Off IP & Services Group to Enable Digital Transformation for the Entire CAD Industry12/04/2023 | EMA Design Automation
EMA Design Automation, the world's premier EDA VAR, is spinning off their IP, content, and services group as a new company named Accelerated Designs, LLC with a focus on CAD agnostic solutions.
SINBON Electronics, a provider of integrated solutions for electronic component design and manufacturing, recently obtained UL certification for its NACS (The North American Charging Standard) AC/DC charging cable. SINBON is the first electronic design service provider in Greater China to obtain this certification, and the first batch of charging cable orders has been shipped this week.
Cadence Signoff Solutions Empower Samsung Foundry’s Breakthrough Success on 5G Networking SoC Design12/01/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced that Samsung Foundry successfully taped out a 5G networking SoC design on the Samsung 5LPE technology using the Cadence® Quantus™ Extraction Solution and Tempus™ Timing Solution.
There are many ways, dozens to be sure, and most likely many more, to streamline a PCB design. My goal here is to pick a single-digit number of rules to abide by, that can be reasonably adhered to, and provide some bang for the buck. These rules are meant to reduce design scope creep, avoid PCB respins, and improve production yields.