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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
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In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
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Cadence, Autodesk Collaborate on Smart Product Design
November 14, 2023 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced a collaboration with Autodesk to provide solutions that accelerate intelligent system design leveraging Autodesk Fusion and Cadence® PCB solutions. This new integration offers customers seamless collaboration between electronic and mechanical engineering to accelerate the development of smart products through efficient co-design.
Electrical and mechanical engineers face increased pressure to produce products with fewer revisions, making efficient collaboration key to delivering smart products to market on time. Current manual design data methods require users to exchange files that can differ from design intent, resulting in errors, unnecessary re-work and costly delays.
To address these challenges, the companies have integrated Autodesk Fusion with Cadence’s Allegro® X and OrCAD® X platforms into a solution that enables seamless bi-directional communication between PCB designers and mechanical engineers. The platform integration enables companies to take full advantage of cloud-based mechanical design and generative AI/ML PCB design, while fully leveraging multiphysics analysis for power, thermal, electromagnetics and more.
“The electronics industry is being disrupted on multiple fronts including supply chain challenges and rapidly accelerating product complexity,” said Tom Beckley, senior vice president, Cadence. “Our partnership with Autodesk provides access to leading-edge technology for electronic design integrated with Autodesk’s leading cloud-enabled, connected mechanical CAD solutions.”
“Our partnership with Cadence powers a seamless collaboration between mechanical and electronics design, putting customers at the center,” said Jeff Kinder, executive vice president, Autodesk. “Manufacturers need to bring more complex products to the market faster – all while juggling distributed teams, supply chain disruptions, and costs. This integration further extends Autodesk’s vision to connect end-to-end design and make processes in manufacturing.”
The AI-based Allegro X and OrCAD X platforms support Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation.
Suggested Items
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
SIA Commends Selections for CHIPS R&D Flagship Facilities
11/04/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.
Siemens, CELUS Collaborate to Empower SMBs with AI-powered PCB Design
10/30/2024 | SiemensSiemens Digital Industries Software, a global leader in PCB electronic systems design, and CELUS, a pioneer in AI-powered electronic design automation solutions, announced their collaboration to transform the PCB design landscape for small and medium-sized businesses (SMBs) and independent engineers.
TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems
10/28/2024 | ANSYSAnsys was recognized at the TSMC 2024 Open Innovation Platform® (OIP) Partner of the Year awards for excellence in design enablement for AI, HPC, and photonics silicon systems.
EMA Presents Webinar on Designing the Perfect Stackup for Flex
10/25/2024 | EMA Design AutomationJoin the experts at Newgrange Design and EMA to make sure you set your next flex project up for success from the beginning in latest webinar.