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Kimball Electronics 2024 Annual Report: Strategically Focused

10/03/2024 | Kimball Electronics
Kimball Electronics releases its 2024 Annual Report, Strategically Focused, highlighting a year of innovation, hard work and commitment to excellence. From groundbreaking projects to sustainable practices, our journey this year has been nothing short of remarkable.

Silicon to Systems: Collaboration Between IC and PCB Design Continues

10/02/2024 | Andy Shaughnessy, Design007
The walls are coming down between the designers of chips and PCBs. Because of the complexity of electronic systems, IC designers and PCB designers are increasingly finding themselves in need of information from technologists upstream and downstream, from silicon through the system level. Stephen Chavez, senior product marketing manager at Siemens, shares his thoughts on this silicon-to-systems approach and what it means for PCB designers, EDA tool providers, and system-level developers as well.

Renesas Leads ADAS Innovation with Power-Efficient 4th-Generation R-Car Automotive SoCs

09/24/2024 | Renesas
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, expanded its popular R-Car Family of system-on-chips (SoCs) for entry-level Advanced Driver Assistance Systems (ADAS).

Understanding Cleaning Challenges for Automated Solder Paste Dispensing

09/18/2024 | Debbie Carboni, KYZEN
In today’s rapidly evolving electronics manufacturing landscape, staying abreast of innovative technologies is crucial. As solder paste and substrate materials continually evolve and become more complex, optimizing production methods with the latest technology ensures performance and quality while reducing operational costs.

IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

09/16/2024 | IPC
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
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