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MacDermid Alpha Launches ALPHA SF828-MBB Photovoltaic Liquid Flux for Advanced Multi-busbar Interconnections
November 21, 2023 | MacDermid AlphaEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/6117/0056/8982/MacDermid_Alpha_Solar.jpg)
MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, introduces ALPHA® SF828-MBB. Designed for soldering small surface areas of wire and delivering excellent peel force and high machine cleanliness, this is MacDermid Alpha’s latest liquid flux for the photovoltaic market.
ALPHA SF828-MBB contains a unique blend of ingredients that overcome the smaller surface area of wire ≤0.4mm used in ever-evolving multi-busbar technology to achieve excellent interconnection. The flux delivers fast wetting with minimal or no heating before wire ribbon dipping for higher process efficiency.
“MacDermid Alpha developed ALPHA SF828-MBB to meet the photovoltaic market’s drive to create applications that provide improved efficiency and reliability,” comments Bernice Chung, Product Manager – Wave Soldering Products at MacDermid Alpha. “The high peel strength provided by ALPHA SF828-MBB ensures long-term reliability of the solder joints for long module life. It also delivers excellent soldering yields and ribbon-cell interconnection.”
During field trials, ALPHA SF828-MBB exhibited less residue, which supports higher power transfer efficiencies and less equipment maintenance. User feedback also noticed superb adhesion and no yellowing bubbling across different EVA laminations.
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