-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueTraining New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
UHDI Fundamentals: Talking UHDI with John Johnson, Part 1
November 21, 2023 | Steve Williams, The Right Approach Consulting LLCEstimated reading time: 1 minute
American Standard Circuits is an early adopter of Averatek’s A-SAP process for its ultra-high definition interconnect (UHDI) products. I sat down with industry veteran John Johnson to discuss this. John, vice president of business development, oversees quality at American Standard Circuits, and previously worked at Averatek. In the spirit of full disclosure, we will be discussing and sharing photos, slides, and materials with permission from both ASC and Averatek. This is the first of a three-part interview.
Steve Williams: Welcome John, good to see you again.
John Johnson: Thank you, Steve. It’s my pleasure. I’m always looking to talk about UHDI and the A-SAP process.
Williams: What does A-SAP stand for? What does it mean?
Johnson: The A in A-SAP stands for Averatek, and of course, SAP is a semi-additive process. So it's an Averatek semi-additive process they've developed for the electronics industry, predominantly circuit boards.
Williams: Very good. You've had a lot of leadership positions in the industry, but before American Standard, you worked at Averatek?
Johnson: I was the vice president of sales and customer support, and, predominantly, my role was working with the licensees to get them up and running, to bring product realization to the forefront with them.
To read this entire conversation, which appeared in the November 2023 issue of Design007 Magazine, click here.
Suggested Items
The Future of Electronics Manufacturing in APAC
01/30/2025 | Daniel Schmidt, MKS' ATOTECHThe Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.
Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
11/21/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
Molex Drives Intelligent Supply Chain Collaboration with SAP Solutions
10/24/2024 | PRNewswireMolex, a global electronics leader and connectivity innovator, announced a highly successful collaboration with SAP to unite a global community of suppliers and buyers as part of Molex's multi-year, intelligent digital supply chain transformation strategy.
Polymatech, ECM Group Forge Strategic Joint Venture for Semiconductor Wafer Fabrication in Grenoble, France
09/12/2024 | PRNewswirePolymatech, a multinational corporation (MNC), a leading player in semiconductor manufacturing with a strong presence in India and global business operations in USA, Singapore, Bahrain, UK and UAE announced the signing of a Memorandum of Understanding (MoU) with ECM Group, a globally recognised leader in advanced microelectronics and semiconductor technologies to establish a Joint Venture Company in Grenoble, France.