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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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IPC Standards and Electronics Sustainability: More Than Meets the Eye
January 5, 2024 | Kelly Scanlon, IPC Lead Sustainability StrategistEstimated reading time: 1 minute
When we look at existing IPC standards, we see that most were created and intended to communicate and clarify expectations for superior quality, reliability, and consistency in electronics manufacturing. At first glance, their connection to sustainability is not obvious.
Yet as we continue to evaluate existing IPC standards against sustainability reporting best practices or requirements for companies in the electronics value chain, there are more than a dozen IPC standards that address important and relevant sustainability topics.
For example, training and education—a relevant and important industry sustainability topic covered by GRI standards—is represented in popular IPC standards, including IPC-A-610, Acceptability of Electronic Assemblies; IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies; and IPC-7711/21, Rework, Modification and Repair of Electronic Assemblies; and the certification programs built around these standards.
The GRI (Global Reporting Initiative) standards focus on the environmental, social, and economic impacts of a company in relation to sustainable development. They represent global best practices for reporting publicly. GRI is just one of four frameworks sustainability disclosures identified as a driver causing companies in the industry to disclose data and information on various sustainability topics and targets. A recent exploratory materiality study of dozens of industry sustainability reports revealed that GRI, along with SASB, TCFD, and CDP, was strongly preferred and most used of the four.
To read the rest of this article, which appeared in the fall issue of IPC Community, click here.
Suggested Items
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”