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PCB007 Magazine January 2024 Issue Released
January 18, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

Getting to Know Your Designer
How well do you really know your designers? What makes for a closer, more synchronized working relationship? After all, as a fabricator, you’re manufacturing what is often the only custom part on the entire electronics subassembly. Earlier this month, we published an issue of Design007 Magazine that helps designers better understand how to work with you, the fabricator. So, what’s key to improving your understanding of how your customer ticks?
In the January 2024 issue of PCB007 Magazine, we investigate how to build a good relationship with designers. Dana Korf, an I-Connect007 columnist, contributed a feature article this month titled “The Designer and Manufacturer Must Be in Sync”; NCAB’s field application engineers explore how to foster loyal customer/vendor relationships; Don Ball of Chemcut uses his column space to talk about the ins and outs of getting to know your vendor; and IPC design instructor (and the most recent addition to the IPC Education Department) Kris Moyer shares his take as a designer with respect to what fabs should be communicating.
We also bring you an interview with Summit Interconnect COO Sean Patterson, who came to the industry from Amazon and talks about culture shift and operational efficiencies.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Five Ways to Revolutionize EMS Sales With AI
10/22/2025 | Nolan Johnson, SMT007 MagazineIf you’ve been in the EMS game for any length of time, you know the sales cycle can be a challenge to navigate. It’s complex, technical, and often a marathon, not a sprint. With OEMs demanding faster turnarounds, tighter margins, and bulletproof supply chains, the pressure is on for EMS providers to stand out in a crowded field.
Global Electronics Association Releases Fall Schedule of Instructor-led Courses
10/20/2025 | Corey Lynn, Global Electronics AssociationWhether you’re looking to enhance your PCB design skills, explore advanced packaging technologies, or deepen your understanding of reliability, these Global Electronics Association courses deliver high-impact learning from the best in the industry. Here are a few starting this week.
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
New Fil Arzola Class: Designing for the Future, and for Sustainability
10/07/2025 | Andy Shaughnessy, I-Connect007If you have not yet taken a class from Fil Arzola, you are missing out. In late October, Fil will be teaching the class "Building Sustainable Model-Based PCBs," speaking from the design perspective. I had the pleasure of catching this course at last year's IPC APEX EXPO, and I walked away with a lot to think about. I asked Fil to discuss his upcoming course. Registration is open now.