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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Cadence Advances ECAD/MCAD Convergence with Celsius Studio AI Thermal Platform
February 1, 2024 | Cadence Design SystemsEstimated reading time: 4 minutes
Cadence Design Systems, Inc. has announced Cadence Celsius Studio, the industry’s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. While current product offerings consist mostly of disparate point tools, Celsius Studio introduces an entirely new approach with a unified platform that lets electrical and mechanical/thermal engineers concurrently design, analyze and optimize product performance without the need for geometry simplification, manipulation and/or translation.
The industry’s first complete AI thermal design and analysis solution for electronic systems, Cadence Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies.
The industry’s first complete AI thermal design and analysis solution for electronic systems, Cadence Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies.
Celsius Studio brings a new system-level thermal integrity solution into the marketplace, converging electro-thermal co-simulation, electronics cooling and thermal stress into one cohesive offering. Made possible by Cadence’s acquisition of Future Facilities in 2022, best-in-class electronics cooling technology is now accessible to electrical and mechanical engineers. Additionally, the ability to employ Celsius Studio seamlessly for in-design multiphysics analysis empowers designers to identify thermal integrity issues early in the design process and efficiently leverage generative AI optimization and novel modeling algorithms to determine ideal thermal designs.
The result is a streamlined workflow that improves collaboration, reduces design iterations and allows predictable design schedules, which in turn reduces turnaround times and accelerates time to market. Celsius Studio delivers the following benefits:
- ECAD/MCAD Unification – Provides seamless integration of design files with no simplification as well as streamlined workflows for fast and efficient in-design analysis
- AI Design Optimization – Cadence Optimality™ Intelligent System Explorer’s AI technology within Celsius Studio enables fast and efficient exploration of the full design space to converge on the optimal design
- In-Design Analysis of 2.5D and 3D-IC Packages – Delivers unprecedented capacity to analyze any 2.5D and 3D-IC packages without any simplification or accuracy loss
- Micro-to-Macro Modeling – The first solution capable of modeling structures as small as the IC and its power distribution and as large as the chassis where the PCB(s) are placed
- Large-Scale Simulation – Accurately simulates large systems with detailed granularity for any object of interest including, chip, package, PCB, fan or enclosure
- Multi-Stage Analyses – Enables designers to perform multistage analyses for the design assembly process and addresses 3D-IC warpage issues for multi-die stacks on a single package
- True System-Level Thermal Analyses – Combines finite element method (FEM) with computational fluid dynamics (CFD) for full-system thermal analysis from chip to package to board and end-system
- Seamless Integration – Integrated with Cadence’s implementation platforms, including Virtuoso® Layout Suite, Allegro® X Design Platform, Innovus™ Implementation System, Optimality Intelligent System Explorer and AWR Design Environment®
“Celsius Studio marks a milestone in Cadence’s expanding presence in the system analysis market by offering the first AI platform for not only chip, package and PCB thermal analysis, but also electronics cooling and thermal stress that are critical for today’s advanced packaging designs, inclusive of chiplets and 3D-ICs,” said Ben Gu, corporate vice president of R&D for multiphysics system analysis at Cadence. “Seamless integration with Cadence’s powerful implementation platforms empowers our customers to perform multiphysics in-design analysis for chips, packages and boards all the way through to complete systems.”
Customer Endorsements
“Celsius Studio enables Samsung Semiconductor engineers the ability to gain access to analysis and design insights during the early stages of the design cycle, simplifying the generation of precise and rapid thermal simulations for 3D-IC and 2.5D packages. Our collaboration with Cadence has significantly increased our product development by 30%, optimizing the package design process and reducing turnaround time.” said WooPoung Kim, Head of Advanced Packaging, Samsung Device Solutions Research America.
“Celsius Studio’s seamless integration with Cadence’s AWR Microwave Office IC design platform through BAE Systems’ custom GaN PDK is enabling fast and accurate thermal analysis throughout the MMIC design cycle, leading to increased first-pass design success and significantly improved RF and thermal power amplifier performance,” said Michael Litchfield, Technical Director, MMIC Design at BAE. Systems
“Celsius Studio enables our design team to work with detailed information early in our design cycle so that we can target and resolve thermal problems before the design is fully committed. With the reduced turnaround time, the Chipletz engineering team has been empowered to efficiently run detailed thermal simulations for 3D-IC and 2.5D packages early and often as we develop these complex designs,” said Jeff Cain, VP of Engineering, Chipletz.
Suggested Items
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.
If You Can Define It Right, You Can Design It Right
12/05/2024 | Andy Shaughnessy, Design007Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance. With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.