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IPC: Electronics Manufacturers Anticipate Revenue Growth Increase of 9.5% in 2024
February 7, 2024 | IPCEstimated reading time: Less than a minute
Electronics Industry sentiment improved during January, with electronics manufacturers, on average, stating that they expect 5.2 percent revenue growth for 2023, with an increase to 9.5 percent in 2024, according to IPC’s January 2024 Global Sentiment of the Electronics Supply Chain Report.
Labor and materials costs continue to rise, with 59 percent of electronics manufacturers experiencing a rise in labor costs while 45 percent report rising material costs.
“Industry insiders appear optimistic about 2024,” said Shawn DuBravac, IPC chief economist. “Demand sentiment rose in January, driven primarily by stronger shipment data.”
Additional survey data show:
- The New Order Index rose 1 point to 102.
- The Shipment Index rose 5 points to 110.
- The Backlog Index was flat at 94.
- The Capacity Utilization Index remained steady at 106 for the third consecutive month.
- Cost measures remain at an all-time low, remaining flat for the third consecutive month.
For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain. View full report.
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On the Line With… Podcast: UHDI and RF Performance
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The Marketing Minute: Cracking the Code of Technical Marketing
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EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.