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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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DOCOMO to Collaborate with AT&T, Verizon and Jio for Open RAN Verifications
February 15, 2024 | JCN NewswireEstimated reading time: 1 minute
NTT DOCOMO, INC. announced today that it will participate in Open RAN verifications in the United States as the ACCoRD (Acceleration of Compatibility and Commercialization for Open RAN Deployments) project in a consortium jointly founded with AT&T Inc. (AT&T), Verizon Communications Inc. (Verizon), and Reliance Jio Infocomm Ltd. (Jio). This consortium was awarded a USD 42.3 million grant from the U.S. Department of Commerce National Telecommunications and Information Administration (NTIA) on February 12.
The consortium comprises telecom operators and US universities and suppliers include equipment vendors from the United States and abroad, and is committed to verifying multi-vendor Open RAN connectivity for further commercial deployments. Leveraging its experiences and expertise in multi-vendor interoperability since the 4G era and Open RAN deployment in 5G networks, DOCOMO will contribute to the realization of integration and interoperability between major and emerging vendors with its consortium partners.
The grant program, part of the Wireless Supply Chain Innovation Fund established by the CHIPS and Science Act of 2022 in the United States, is aimed at promoting open and interoperable solutions in the wireless communication equipment market, stimulating the ecosystem, and providing grants to activities advancing verification, adoption and deployment of such technology and equipment.
Going forward, DOCOMO will contribute to supporting operators in their adoption of Open RAN through this consortium and the company's Open RAN service brand OREX®.
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EMS Leaders Express Optimism Through Growth and Expansion
03/18/2026 | Mark Wolfe, Global Electronics AssociationIt was a strong opening day for APEX EXPO 2026, with a keynote by Zach Kass on the AI revolution, followed by a ribbon-cutting to officially open the event, which featured Irish dancers on this St. Patrick’s Day, and opening remarks by Global Electronics Association CEO John Mitchell. But I’d like to tell you about the EMS Leadership Summit on Monday, where approximately 60 EMS industry leaders from 40 companies participated. There were several speakers, a panel discussion, and discussion groups.
Real Time with... APEX EXPO 2026: Exploring PCB Fabrication and Industry 4.0 Innovations with Burkle
02/23/2026 | Real Time with... APEX EXPONolan Johnson speaks with Andy Turner, CEO of Burkle North America, about PCB fabrication and pressing technologies. They discuss the significance of Industry 4.0, focusing on machine integration and data collection for improved manufacturing efficiency. The conversation covers Burkle's adoption of the Open Platform Communications Unified Architecture (OPC UA) protocol for better data sharing and the role of AI and automation in enhancing processes and customer interactions.
OpenAI and Foxconn Collaborate toStrengthen U.S. Manufacturing Across the AI Supply Chain
11/21/2025 | OpenAIOpenAI announces a collaboration with Foxconn focused on design work and U.S. manufacturing readiness for the next generation of AI infrastructure hardware. As part of this work, OpenAI will share insight into emerging hardware needs across the AI industry to help inform Foxconn’s design and development efforts for hardware to be manufactured at Foxconn’s U.S. facilities.
AV, OpenJAUS Announce Collaboration for Autonomous Uncrewed System (UxS) Interoperability
10/31/2025 | BUSINESS WIREAeroVironment, Inc. (AV), a global defense technology leader delivering software-enabled disruptive autonomous systems, announced a collaboration with OpenJAUS, LLC., a leader in middleware software solutions for unmanned and robotic systems, to integrate the JAUS standard into AV_Halo™ Command, a first-of-its-kind cross-architecture software solution for controlling uncrewed systems (UxS).
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.