Elementary, Mr. Watson: High Power: When Physics Becomes Real
The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Design Guidelines for Flexible Printed Circuits
February 15, 2024 | Chris Keirstead, PFC Flexible CircuitsEstimated reading time: 1 minute
An important but sometimes overlooked aspect of flex and rigid-flex fabrication and assembly is the flex circuit tail, which is attached to a rigid PCB with pressure-sensitive conductive adhesives. This sub-assembly is becoming very common. We often see this applied to glass displays and microelectronic applications.
But this method of attachment without connectors is not as straightforward as one may think. The wide varieties of circuitry to be bonded create many attachment challenges. The best track configuration is not always possible, so one must be familiar with the optimum layouts as well as what is not recommended when considering these trade-offs. Less than optimum trace and pad layouts result in the need for more customization and smaller processing window variations for the bonding process.
Here are some common configurations that flex assemblers have developed, and the preferred approach for the method of bonding.
Interposer Effect and Co-planarity Adjustment
Bonding imbalance results from either bad co-planarity between the bonder head and stage or a thickness deviation of the flex and PCB materials. The interposer will absorb these discrepancies to some extent and help bring the bonding results in parallel.
To read this entire article, which appeared in the February 2024 issue of Design007 Magazine, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
NextFlex Announces New Affiliated Alabama ‘Node’ to Support Growing National Hybrid Electronics Community
10/16/2025 | PRNewswireNextFlex®, America's Hybrid Electronics Manufacturing Innovation Institute, announced the launch of a new Alabama Node. The Alabama Node will accelerate the commercialization of hybrid electronics by boosting innovation, technology transition, and adoption.
Flex Announces New AI Infrastructure Platform to Speed Deployment by Up to 30%
10/13/2025 | FlexFlex announced the industry's first globally manufactured, fully integrated platform designed for gigawatt data centers supporting AI and HPC.
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
10/15/2025 | Bob Duke -- Column: Global Sourcing SpotlightIn global sourcing, speed is a necessity; however, speed without flexibility is a recipe for chaos. Likewise, flexibility without structure leads to inefficiency. Companies thrive when they build agile global sourcing strategies that allow them to move quickly while adapting to market fluctuations, customer demands, and supply chain disruptions. Here’s how leading organizations successfully navigate the critical gap between speed and flexibility in global sourcing.
Draganfly Enlisted by U.S. Army to Deliver Drones on Heels of Developing Drones for Border Security
10/10/2025 | DraganflyDraganfly Inc., an industry-leading developer of drone solutions and systems, announced its selection by the U.S. Army to provide Flex FPV drone systems.
American Standard Circuits to Exhibit at SMTA International
10/06/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again exhibit at SMTA International 2025 to be held at the Donald E Stephens Convention Center in Rosemont, Illinois on October 19th through the 23rd, 2025.