-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Releases Newest List of Standards Updates, Revisions
February 20, 2024 | IPCEstimated reading time: 2 minutes
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status.
IPC-1791D
Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-1791D provides minimum requirements, policies, and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products.
IPC-6012F
Qualification and Performance Specification for Rigid Printed Boards
IPC-6012F covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias, and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance, as well as electrical, mechanical, and environmental requirements.
IPC-1782B
Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used, and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication.
IPC/WHMA-A-620E-S
Revision E—Addendum—Space and Military: Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620
IPC/WHMA-A-620E-S space addendum provides additional requirements to IPC/WHMA-A-620E standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments.
IPC-2591-V1.6
Connected Factory Exchange (CFX)
IPC-2591, Version 1.6 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. The standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated, and manual, and is applicable to related mechanical assembly and transactional processes.
IPC-9203A
Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
While there are a variety of industry test vehicles for the examination of material compatibility, the IPC-B-52 test board was created to meet the needs for testing both ion chromatograph and surface insulation resistance (SIR), which would be more representative of the manufacturing materials and processes. IPC-9203A standard addresses the IPC-B-52 test vehicle, which can be used to evaluate a manufacturing process, or to provide objective evidence that a chosen manufacturing material set and process are compatible from a cleanliness standpoint.
This list of standards originally appeared in the Winter 2024 issue of IPC Community. Read more articles about standards development work in each issue.
Suggested Items
IPC Announces New Training Course: PCB Design for Manufacturability
01/10/2025 | IPCThis three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge and skills to reduce or eliminate design, documentation, and capability issues that often arise during PCB fabrication.
TRI Launches 3D AXI Platform with Clearer Imaging
01/10/2025 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600FB SII system, designed to deliver clearer imaging.
Focus on electronica: Future Challenges From a Designer’s Viewpoint
01/09/2025 | I-Connect007 Editorial TeamThomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.
Marcy LaRont Named I-Connect007 Executive Director
01/08/2025 | IPCMarcy LaRont, a printed circuit board (PCB) industry veteran who has been working as the managing editor for PCB007 Magazine this past year, has been named executive director of the I-Connect007 group of publications, which was purchased by IPC in 2022.
The Government Circuit: How IPC Drove Industry Progress Through Public Policy Advocacy in 2024
01/07/2025 | Chris Mitchell -- Column: The Government CircuitIn 2024, IPC Government Relations continued to shift the narrative about electronics manufacturing in the halls of government, overcoming decades of policymaker indifference in Washington and Brussels. In Asia, where several governments have taken significant strides to foster their domestic electronics ecosystems, IPC broadened its government relations efforts.