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IPC Releases Newest List of Standards Updates, Revisions
February 20, 2024 | IPCEstimated reading time: 2 minutes
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status.
IPC-1791D
Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-1791D provides minimum requirements, policies, and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products.
IPC-6012F
Qualification and Performance Specification for Rigid Printed Boards
IPC-6012F covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias, and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance, as well as electrical, mechanical, and environmental requirements.
IPC-1782B
Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used, and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication.
IPC/WHMA-A-620E-S
Revision E—Addendum—Space and Military: Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620
IPC/WHMA-A-620E-S space addendum provides additional requirements to IPC/WHMA-A-620E standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments.
IPC-2591-V1.6
Connected Factory Exchange (CFX)
IPC-2591, Version 1.6 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. The standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated, and manual, and is applicable to related mechanical assembly and transactional processes.
IPC-9203A
Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
While there are a variety of industry test vehicles for the examination of material compatibility, the IPC-B-52 test board was created to meet the needs for testing both ion chromatograph and surface insulation resistance (SIR), which would be more representative of the manufacturing materials and processes. IPC-9203A standard addresses the IPC-B-52 test vehicle, which can be used to evaluate a manufacturing process, or to provide objective evidence that a chosen manufacturing material set and process are compatible from a cleanliness standpoint.
This list of standards originally appeared in the Winter 2024 issue of IPC Community. Read more articles about standards development work in each issue.
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11/21/2024 | IPCIPC hosted its Hand Soldering World Championship in Munich, Germany, at electronica on 14-15 November 2024, welcoming 14 competitors from 13 companies and 12 countries worldwide. Skilled contestants competed to build an electronics assembly in accordance with IPC-A-610 Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process and overall product quality. The contestants were allowed a maximum of 60 minutes to complete the assembly.
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Enjoy the Journey: PCB Design Instructor Kris Moyer on His Sustainable Lifestyle
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IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
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IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.