Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
ROCKA Solutions' Justin Worden to Present at SMTA Dallas Expo & Tech Forum:
February 23, 2024 | ROCKA SolutionsEstimated reading time: 1 minute
ROCKA Solutions is excited to announce that Justin Worden, Vice President of Sales & Marketing, will present at the upcoming SMTA Dallas Expo & Tech Forum. The event is scheduled to take place Tuesday, March 19, 2024 at the Plano Event Center.
In his presentation titled "Elevating Excellence in High-Reliability Electronics: The Personal and Lasting Legacy of PCB Production," Worden will delve into the crucial role of modern equipment and processes in achieving superior quality and reliability in PCB production. The presentation explores how upgrading production lines with modern technology is essential for meeting the increasingly demanding requirements of today's advanced PCBs, particularly in industries such as aerospace, military, medical devices and automotive.
"Business is Personal" is the central theme of the presentation, emphasizing the profound impact that modernized PCB production has on ensuring safety, quality and customer satisfaction in high-reliability electronics. By embracing modernization, manufacturers can establish a legacy built on trust and excellence, driving forward the standard of excellence in electronics production.
Rodrigo Cacho, President and CEO of ROCKA Solutions commented: "Justin’s expertise and insights into the importance of modernization in PCB production will provide attendees with valuable knowledge and strategies for high-reliability electronics."
Share on:
Suggested Items
Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Kitron Signs Contract for Marine IoT Technology
12/23/2024 | KitronKitron has entered into a manufacturing contract with a leading technology company focusing on innovative IoT solutions.
High-Generation Panel Production Expected to Drive OLED Notebook Penetration Rate Past 5% by 2027
12/20/2024 | TrendForceTrendForce's latest OLED Technology and Market Development Report reveals that the penetration rate of OLED displays in notebooks is set to increase to 3% in 2024, driven by large-scale procurement from Chinese laptop brands. While growth in 2025 is expected to be moderate, the anticipated introduction of OLED displays in Apple’s MacBook lineup will mark a significant turning point.
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Toray Engineering Launches TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
12/17/2024 | ACCESSWIREToray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024.