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Embedded Capacitors for PCBs, Chips, and Packages
February 26, 2024 | Cody Stetzel, Cadence Design SystemsEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/7416/9086/9839/Cody_Stetzel_250.jpg)
Decoupling capacitors are the first place for systems designers to start building digital systems with sufficient power integrity. While decoupling/bypass capacitors are still a standard strategy for ensuring power integrity in single digital ASICs, the entire system power bus also needs to be approached throughout broader frequency ranges. The approach combines power integrity design at low frequencies, where discrete caps dominate, and up to GHz frequencies where discrete caps have trouble providing the required capacitance.
Package designers and chip designers assist the PCB layout engineer by including embedded capacitors on-chip and in-package to address the entire range of frequencies where decoupling is needed. As more electronics companies take a leading role in chip and package design, there is a need to determine the appropriate amount of capacitance needed to ensure low PDN impedance throughout broad frequency ranges. This article will look at the different types of capacitors that can be used as embedded components in PCBs and in chips/packages.
To read this entire article, which appeared in the February 2024 issue of Design007 Magazine, click here.
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