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ASC Sunstone Proudly Sponsors SMTA’s Ultra High-Density Interconnects (UHDI) Event
February 27, 2024 | ASC SunstoneEstimated reading time: 1 minute
ASC Sunstone, a leading provider of high-quality printed circuit board (PCB) solutions, is pleased to announce its sponsorship of the upcoming Ultra High-Density Interconnects (UHDI) event hosted by the Surface Mount Technology Association (SMTA). The event, titled "Advancements in HDI: Driving Innovation Forward," will serve as a platform for industry professionals to explore the latest trends and technologies in high-density interconnects.
Scheduled to take place on March 26th, the event will feature presentations from renowned experts in the field which will include John Johnson from ASC Sunstone. Topics will cover advances in UHDI design, manufacturing processes, material innovations, and reliability considerations.
As a company committed to innovation and excellence in PCB manufacturing, ASC Sunstone recognizes the importance of supporting events like this that promote industry advancement and facilitate meaningful dialogue among peers.
"We are thrilled to sponsor the SMTA UHDI event," said Anaya Vardya, CEO of ASC Sunstone. "Innovation in ultra high-density interconnects is driving significant changes in the electronics industry, and we are proud to be at the forefront of this evolution. This event provides an invaluable opportunity for professionals to come together, share insights, and collaborate on shaping the future of UHDI technology."
The event will take place at Peoria Sports Complex in Peoria, AZ, and registration is open to professionals from across the electronics manufacturing industry. Attendees can register for the event on the SMTA website at smta.org/mpage/uhdi.
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- Podcast: On the Line with...ASC Sunstone, Designing for Reality
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- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
Visit I-007eBooks.com to download these and other free titles.
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