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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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SMTA Ultra High-Density Interconnect Symposium Is Nearly Here
February 27, 2024 | SMTAEstimated reading time: 2 minutes
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology. As feature sizes continue their relentless journey towards miniaturization, this symposium will provide insight into the rapidly evolving landscape of Ultra HDI: PCB Design, Fabrication, Assembly, and Reliability. Topics will include:
- Bridging the gap between OEM demands and Ultra HDI innovation
- Materials that redefine Ultra HDI possibilities
- Paradigm-shifting PCB fabrication techniques
- Assembly success: overcoming challenges in shrinking feature sizes
- Design strategies that address both complexity and performance
- Ensuring reliability in Ultra HDI solutions
- Interplay between Ultra HDI and the burgeoning semiconductor landscape
From our presenters and sponsors –
“Celebrating the convergence of advanced technology and miniaturization, the SMTA UHDI Symposium offers a window into the future of PCBs. With UHDI technology at its core, this event illuminates the path toward smaller yet more powerful electronic component. … Joining industry pioneers at this conference isn't just about staying informed – it’s an opportunity to immerse yourself in the latest advancements with industry experts, connect with peers, and be at the forefront of innovation. – PRESENTER, Jan Pedersen, NCAB Group
“In my opinion, ultra HDI manufacturing is a game-changer for PCB fabricators in North America, enabling the production of highly complex and densely populated boards that meet the demands of advanced applications. … By embracing even select UHDI processing techniques, which will be highlighted in this year’s SMTA UHDI Symposium, PCB fabricators can differentiate themselves and deliver cutting-edge solutions that drive growth and success in the industry." – PRESENTER, Raanan Novik, KLA
"Peoria is thrilled to showcase its momentum in the semiconductor sector through the prestigious SMTA Global Conference," said Jennifer Stein, Director of Economic Development. "The recent addition of Amkor to our city underscores our commitment to fostering innovation and creating opportunities for growth in advanced manufacturing and related industries. Our infrastructure, great year-round climate, and access to specialized talent make Peoria a great location for businesses to expand or relocate.”
Thought leaders and experts from across a broad spectrum are invited to attend and contribute to the discussion and to help accelerate the development and implementation of this important technology and ultimately, shorten the time to move from the prototyping phase of process and product development to a proven process in the high mix, low volume manufacturing environment.
The SMTA Ultra-HDI conference will be held on March 26th, 2024 at the Peoria Sports Complex at 16101 N. 83rd Ave., Peoria, AZ. Registration is now open at SMTA.org.
Suggested Items
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
Real Time with... electronica 2024: NCAB—Shaping the Future of Electronics Manufacturing
12/05/2024 | Real Time with... electronicaMichael Larsson, Global Director of Sales at NCAB, shares insights into the company's focus on sourcing production outside of China as well as their commitment to sustainability through innovative materials for recyclable PCBs.
UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 1
11/14/2024 | Anaya Vardya, American Standard CircuitsLast month, I talked about ultra high definition interconnect (UHDI) in relation to entertainment applications. This month, I will explain bleeding-edge UHDI applications in manufacturing, which are revolutionizing the industry by enabling ultra-precise visual data transmission, high-speed communication between devices, and real-time monitoring. These UHDI technologies help manufacturers achieve higher efficiency, better quality control, and greater automation. Following are some leading-edge manufacturing applications of UHDI in manufacturing.
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.