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Embedded Design: Materials Matter
February 27, 2024 | John Andresakis, Quantic Ohmega-TicerEstimated reading time: 1 minute
The rapid advance of mobile technologies has sparked an insatiable demand for radio spectrum bandwidth. The rush to capitalize on wider bandwidths, higher data rates, and lower latency offered by frequency bands like 5G and millimeter wave is evident across industries. Cellular 5G and 6G networks, low-Earth orbit (LEO) and mid-Earth orbit (MEO) satellites, interconnected devices (IoT), autonomous vehicles, and even defense and environmental monitoring systems are driving this paradigm shift. To manage the influx of signals from these diverse applications, antennas, and sensors are undergoing a critical evolution, becoming increasingly sophisticated and miniaturized.
To ensure high data-rate connectivity in this complex landscape, broadband high-gain antennas are experiencing a significant transformation. Traditional dish and horn antennas give way to flat-panel active electronically steered arrays (AESA) for beam-forming and massive MIMO designs. These AESA arrays, capable of shaping azimuth, elevation, and antenna patterns on demand, are vital for directing beams toward specific devices and maximizing signal efficiency. To accommodate this shift, the RF industry has rapidly developed new integrated circuits, materials, processes, and equipment to build reliable and accurate devices for these mission-critical sensor applications.
Much of the engineering expertise behind these modern AESA systems draws inspiration from phased array antennas and Ka/Ku-band radar technologies typically used in defense applications. These robust systems have paved the way for AESA products that can dynamically control beam direction and target specific communication devices. However, as these technologies migrate from the defense and space sectors to commercial markets, challenges arise for designers who may not have extensive experience with AESA systems. One particular concern involves managing the limited surface area on PCBs while adhering to tighter routing requirements and accommodating a higher layer count.
To read this entire article, which appeared in the February 2024 issue of Design007 Magazine, click here.
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