-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Embedded Design: Materials Matter
February 27, 2024 | John Andresakis, Quantic Ohmega-TicerEstimated reading time: 1 minute

The rapid advance of mobile technologies has sparked an insatiable demand for radio spectrum bandwidth. The rush to capitalize on wider bandwidths, higher data rates, and lower latency offered by frequency bands like 5G and millimeter wave is evident across industries. Cellular 5G and 6G networks, low-Earth orbit (LEO) and mid-Earth orbit (MEO) satellites, interconnected devices (IoT), autonomous vehicles, and even defense and environmental monitoring systems are driving this paradigm shift. To manage the influx of signals from these diverse applications, antennas, and sensors are undergoing a critical evolution, becoming increasingly sophisticated and miniaturized.
To ensure high data-rate connectivity in this complex landscape, broadband high-gain antennas are experiencing a significant transformation. Traditional dish and horn antennas give way to flat-panel active electronically steered arrays (AESA) for beam-forming and massive MIMO designs. These AESA arrays, capable of shaping azimuth, elevation, and antenna patterns on demand, are vital for directing beams toward specific devices and maximizing signal efficiency. To accommodate this shift, the RF industry has rapidly developed new integrated circuits, materials, processes, and equipment to build reliable and accurate devices for these mission-critical sensor applications.
Much of the engineering expertise behind these modern AESA systems draws inspiration from phased array antennas and Ka/Ku-band radar technologies typically used in defense applications. These robust systems have paved the way for AESA products that can dynamically control beam direction and target specific communication devices. However, as these technologies migrate from the defense and space sectors to commercial markets, challenges arise for designers who may not have extensive experience with AESA systems. One particular concern involves managing the limited surface area on PCBs while adhering to tighter routing requirements and accommodating a higher layer count.
To read this entire article, which appeared in the February 2024 issue of Design007 Magazine, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
10/08/2025 | Markus Voeltz -- Column: Global PCB ConnectionsNot every PCB fabricator is a good fit for every design. This is something many seasoned OEMs and greenhorn designers learn the hard way. The industry is full of talented board shops: global giants, regional specialists, niche fabricators, and everything in between. But even the best shop can fail a job if it's not the right fit for that specific board, volume, or customer requirement.
American Standard Circuits to Exhibit at SMTA International
10/06/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again exhibit at SMTA International 2025 to be held at the Donald E Stephens Convention Center in Rosemont, Illinois on October 19th through the 23rd, 2025.
Highlights from the IMAPS Onshoring Advanced Packaging Workshop in Washington, D.C.
09/30/2025 | Marcy LaRont, I-Connect007IMAPS and the Global Electronics Association co-hosted the Onshoring Advanced Packaging and Assembly Workshop in Washington, D.C., in early September. Government leaders, including those from the Department of Defense, attended and were directly involved in organizing the content of the sessions. Jim Will, director of the U.S. Partnership for Assured Electronics, speaks about his role in the event.