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New Episode Now Available: Designing for Reality—CAM, Materials, and Imaging
March 14, 2024 | I-Connect007Estimated reading time: Less than a minute
A new episode of I-Connect007's podcast series, On the Line With..., is now available. This season, the podcast focuses on designing for reality in the electronics industry. In Episode 3, host Nolan Johnson talks to ASC Sunstone VP/Manager Matt Stevenson about what happens after CAM preparations are complete. Stevenson addresses the role of materials and stackup considerations and also walks listeners through what happens in the Imaging process.
This season of the podcast is all about the specifics that can affect your circuit board during the manufacturing process, including tips and tricks for optimizing design, fabrication, yields, and cost. The series is suitable for all skill levels and aims to provide valuable insights into the industry.
Listen to Episode 3 of On the Line With...ASC Sunstone: Designing for Reality now.
I-Connect007 is committed to providing digital content that meets the needs of the electronics industry. As the industry's longest-running digital media company, I-Connect007 is a leading publisher of exclusive content for the global electronics industry.
Visit our educational resource center to access more free content.
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Sweeney Ng - CEE PCBSuggested Items
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.
New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!
09/29/2025 | I-Connect007The final episode of the On the Line with… Optimize the Interconnect podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing. Final guest Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase.
Meet the Author Podcast Features Dr. Pritha Choudhury
09/24/2025 | I-Connect007I-Connect007 announces the latest episode of its Meet the Author podcast series, spotlighting Dr. Pritha Choudhury, a co-author of The Printed Circuit Assembler’s Guide to Low-temperature Soldering, Volume 2. In this conversation with SMT007 Managing Editor Nolan Johnson, Dr. Choudhury explains why a second volume was essential and explores the real-world factors accelerating the adoption of low-temperature soldering across the electronics manufacturing industry.