-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
New Episode Now Available: Designing for Reality—CAM, Materials, and Imaging
March 14, 2024 | I-Connect007Estimated reading time: Less than a minute
A new episode of I-Connect007's podcast series, On the Line With..., is now available. This season, the podcast focuses on designing for reality in the electronics industry. In Episode 3, host Nolan Johnson talks to ASC Sunstone VP/Manager Matt Stevenson about what happens after CAM preparations are complete. Stevenson addresses the role of materials and stackup considerations and also walks listeners through what happens in the Imaging process.
This season of the podcast is all about the specifics that can affect your circuit board during the manufacturing process, including tips and tricks for optimizing design, fabrication, yields, and cost. The series is suitable for all skill levels and aims to provide valuable insights into the industry.
Listen to Episode 3 of On the Line With...ASC Sunstone: Designing for Reality now.
I-Connect007 is committed to providing digital content that meets the needs of the electronics industry. As the industry's longest-running digital media company, I-Connect007 is a leading publisher of exclusive content for the global electronics industry.
Visit our educational resource center to access more free content.
Suggested Items
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Are You Ensuring PCB Durability? Dive into Solder Mask and Legend on 'On the Line With…’ Podcast
08/12/2024 | I-Connect007Don't miss the latest episode of "On the Line With… ASC Sunstone: Designing for Reality," featuring ASC Sunstone’s Matt Stevenson as we delve deeper into the PCB manufacturing process. With a functioning PCB in hand, there’s still essential work to protect it from environmental effects and document the circuit components. This episode focuses on the crucial steps of applying solder mask and silkscreen.
DigiKey Debuts City Digital Season 4 Video Series Focused on Artificial Intelligence
06/28/2024 | Digi-KeyDigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announced the release of Season 4 of the City Digital video series, “AI in the Smart World,” sponsored by Molex and STMicroelectronics.
ASC Sunstone Talks Imaging in Latest Podcast Episode
06/11/2024 | I-Connect007Each circuit board is composed of a one-of-a-kind pattern of metal connections representing the specific design for that circuit. So, how do those unique features get mapped onto the board? Find out in this episode as Matt Stevenson paints a picture of the outer layer imaging process.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/31/2024 | Marcy LaRont, PCB007 MagazineThis week, our columnists enjoy particular attention with Barry Olney, Mehul Dave, and Happy Holden all providing valuable insight on materials, the critical importance of the front-end engineering process once a PCB design is received, and an overview and observations around IPC APEX EXPO technical sessions.