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On the Line With… Talks With Cadence Experts on Changing How PCBs Are Designed and the Role of AI
March 21, 2024 | I-Connect007Estimated reading time: Less than a minute

I-Connect007 is excited to announce the latest episode of Season 3 of its popular podcast, On the Line With..., is now available on I-Connect007, Apple and Spotify.
In this newest season, “PCB 3.0: A New Design Methodology,” host Nolan Johnson speaks with Cadence experts about the shift taking place in the methods used for designing circuit boards. In this second episode, Cadence Distinguished Engineer Taylor Hogan and Product Management Director Patrick Davis discuss the role artificial intelligence and machine learning play in intelligent system design.
I-Connect007 is committed to providing readers, viewers, and listeners with a wide range of digital content and information to help them succeed in the industry. From magazines, books, and newsletters to market reports, podcasts, and event coverage, we provide digital content that suits the needs of our community, with particular emphasis on hearing from the industry itself.
I-Connect007 is the industry's longest-running digital media company and leading publisher of original, exclusive content for the global electronics industry.
Listen now to Episodes 1 and 2 of PCB 3.0: A New Design Methodology.
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I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/08/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.
On the Line With… Podcast: UHDI and RF Performance
09/22/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra High Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).