UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium 

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American Standard Circuits (ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI).

As an early adopter of Averatek’s A-SAP process, ASC is leading the industry in advancing this technology and working with PCB designers and OEM/ODMs on developing new applications that can take advantage of the sub-25-micron line width and space capability. The event is organized by SMTA (Surface Mount Technology Association), which has been dedicated to sharing practical knowledge in the electronics manufacturing industry for 40 years.

Tara Dunn, SMTA director of education and training, and Kat Erdahl, SMTA events and administrative manager, have put together an agenda of the preeminent industry experts in UHDI who will be speaking on various topics. In addition to the speakers, there will be a roundtable discussion moderated by Mike Marshall of NCAB Group.

John Johnson of American Standard, Altium’s David Haboud, and Chrys Shea of Shea Engineering will speak on the design of a UHDI PCB test vehicle that ASC will be building to optimize performance through UHDI design, fabrication, and assembly processes. The PCB test vehicle design will be the topic of the next issue of this UHDI series. Other key discussions will include:

1. UHDI journey: How we got here from the early subtractive processes to the various current technologies that allow the game-changing sub-25-micron trace and space width.
2. Material selection: The choice of materials for the interconnects is crucial. Materials with high conductivity, low resistance, and good thermal properties are preferred. Copper and gold are commonly used for their excellent electrical conductivity, while materials like silicon and diamond are used for their thermal properties.
3. Design and layout: The design and layout of the interconnects play a significant role in optimizing their performance. Factors such as the width, length, and spacing of the interconnects, as well as the number of layers, need to be carefully considered to minimize resistance, capacitance, and signal delay.
4. Reliability and durability: UHDIs must be reliable and durable to withstand the rigors of operation. Techniques such as stress testing, accelerated aging, and failure analysis are used to ensure the reliability and durability of UHDIs.
5. Technology availability: The availability of both domestic and global capability of organizations that can produce this technology is a concern as UHDI applications continue to increase and the ability to meet demand requirements are currently somewhat limited.

Title: Ultra High Density Interconnect Symposium

Date: March 26, 2024

Location:   Peoria Sports Complex, Peoria, Arizona

Registration Link

Anaya Vardya is president and CEO of American Standard Circuits; co-author of The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals. He is the author of Thermal Management: A Fabricator's Perspective and The Companion Guide to Flex and Rigid-Flex Fundamentals. Visit I-007eBooks.com to download these and other free, educational titles.

This article appeared in the March 2024 issue of Design007 Magazine.