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Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
March 29, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MacDermid Alpha Electronics Solutions. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting.
Peer Reviewer Dr. Helmut Schweigart, from Zestron Europe, offered his recommendation of the book, stating, “Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. Turner is always conscious of the need for sustainability when it comes to the encapsulation of electronic assemblies.”
Download your free copy today at I-Connect007.com/ese.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
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