Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design
Beyond Design: High-speed Rules of Thumb
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
March 26, 2024 | ITW EAEEstimated reading time: 1 minute
ITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
NPI Awards recognize the leading new products for electronics assembly during the past 12 months. Recipients are selected by an independent panel of practicing industry engineers. ITW EAE will be showcasing the Deep Wave option on the Electrovert Wave Soldering Machine at IPC APEX booth 2327 through Thursday, April 11, 2024, in Anaheim.
A major market trend is that PCB designs continue to increase in complexity and cost. Board assembly manufacturers therefore rely on equipment suppliers to innovate options providing increased performance and capabilities. An area of attention pertaining to high density/high value plated-through-hole (PTH) board assembly designs is the use of wave soldering to maximize throughput and optimize soldering results.
The Deep Wave option overcomes the challenges associated with deep pockets and masking and provides a wave depth necessary to achieve topside hole fill. In some applications the 20 mm capability has removed the need for an additional soldering process. The Deep Wave option is a recipe-controlled parameter in the machine software that can make changes between different wave heights within 10 seconds. The Deep Wave option complements other Electrovert value added options including ExactaWave (automatic wave height adjustment), adjustable wave pump RPM’s settings, forced convection blower speed adjustments and precision selective fluxing that can all be adjusted on-the-fly.
We are very proud to be recognized with the NPI award for this innovative technology,” said Greg Calvo, ITW EAE Wave Soldering Business Manager. “Electrovert’s Deep Wave solution to increasing wave height for increased capability provides many benefits to manufacturers that value production line throughput, maximum soldering performance quality, and flexibility in demanding production environments.”
Share on:
Suggested Items
Dymax to Showcase Innovative Adhesives at COMPAMED 2024
11/08/2024 | DymaxDymax, a leading manufacturer of rapid curing materials and equipment, will showcase its latest developments in medical technology at this year’s COMPAMED in Düsseldorf, from November 11 to 14, in Hall 8B, Booth L01.
Aspocomp to Showcase Expertise at European Microwave Exhibition
09/16/2024 | AspocompAspocomp, a leading provider of advanced printed circuit board (PCB) solutions, is excited to announce its participation at the European Microwave Exhibition (EuMW) 2024.
StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium
09/11/2024 | StratEdgeStratEdge Corporation announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.
American Standard Circuits to Exhibit at European Microwave Week 2024
09/09/2024 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits announced that his company will be exhibiting at European Microwave Week 2024 to be held at the Paris Convention Center in Paris, France from September 22 through September 27, 2024.
Inmarsat’s NexusWave Trialed by Hapag-Lloyd for Enhanced Maritime Connectivity
09/09/2024 | InmarsatInmarsat Maritime, a Viasat company, has announced that global container liner shipping group Hapag-Lloyd is among the first to trial NexusWave, the fully managed service which delivers an unparalleled global service orchestrated by bringing together a multi-orbit, multi-band set of connectivity networks as a single network solution.