Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Sivers Semiconductors Partners with DigiKey to Expand Global Access to Wireless Products and Evaluation Kits

12/09/2025 | Sivers Semiconductors AB
Sivers Semiconductors AB, a global leader in photonics and wireless technologies, announced a strategic partnership with DigiKey, a leading global distributor of electronic components and automation products.

Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards

10/20/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced that it has won four Open Innovation Platform® (OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions.

iNEMI & ZESTRON Workshop: Advanced Packaging and its Impact on mm/Wave Applications

10/18/2023 | iNEMI
A workshop sponsored by iNEMI and ZESTRON Corporation will be held on November 7, 2023  at 9:00 a.m.-5:00 p.m.

iNEMI Workshop on Advanced Packaging and Its Impact on mm/Wave Applications

10/13/2023 | ZESTRON
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is proud to co-sponsor the upcoming workshop, "Advanced Packaging and its Impact on mm/Wave Applications," in collaboration with the International Electronics Manufacturing Initiative (iNEMI).

5G/6G MAESTRO Roadmap on Low Loss Dielectric Materials Characterization Available Online

08/18/2023 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI) announces the availability of the Low Loss Dielectric Materials Characterization Roadmap, which is part of the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in