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Creators of SMT UHDI Test Board Vehicle Discuss this Important Project
April 4, 2024 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute
Chrys Shea of Shea Engineering and Altium’s David Haboud educate us on the latest revision of the SMT test board for UHDI testing, presented at the SMTA UHDI Symposium on March 26 in Arizona. Chrys was involved in the original SMT test board, introduced roughly five years ago. She and David discuss recreating the test board to be appropriate for UHDI, the genesis and history of this project, and why industry members should make use of it to benchmark their processes.
Suggested Items
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
Real Time with... SMTAI 2024: SMTA Austin on the Grow
11/04/2024 | Real Time with...SMTAIIn this interview from SMTAI 2024, Nolan Johnson chats with SMTA Austin Chapter Treasurer Brad Pagano, who shares what he's learned in his first 10 months of board service with this growing chapter. His insights are good advice for board members in other chapters.
CEE PCB to Exhibit at Electronica 2024
10/31/2024 | CEE PCBTom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.