The Shaughnessy Report: Showing Some Constraint
Elementary, Mr. Watson: Rein in Your Design Constraints
Target Condition: Are Autorouters Friend or Foe?
MKS Introduces ESI Geode G2 CO2 Laser System for High- Precision and High-Speed HDI and mSap Via Drilling
April 9, 2024 | ESIEstimated reading time: 2 minutes
MKS Instruments, Inc., a global provider of technologies that transform our world, today announced the official launch of the ESI Geode™ G2 laser drill system, the next generation of the Geode™ platform for processing PCB and ICP materials.
To address the increased market pressure manufacturers face to deliver components that meet precise via and material requirements for today's advanced electronics, the next generation Geode™ G2 laser drilling system offers advancements in beam control capabilities, optical transmission, thermal management, and AOD technology. These innovations enable PCB manufacturers to meet the high accuracy and throughput demands of today's complex PCB applications that utilize high-frequency compatible materials and finer-pitched interconnects. The lightweight frame design of the Geode G2 provides extensive flexibility for factory floor layouts due to its smaller footprint and, combined with industry-leading application flexibility, enables customers to design the factory of the future.
"Our partners are working to resolve some of the most complex challenges in PCB via drilling, including producing new components in emerging technology markets such as low earth orbit satellites. They also face the challenge of building new factories within the rapidly expanding Southeast Asia market," said Michael Stubelt, MKS Vice President and General Manager - Equipment Solutions Business "We are committed to providing our customers with the most innovative CO2 laser drilling system on the market to help meet these challenges. We are proud to announce that the Geode G2 laser drill beta systems have proven successful in key applications, and we have recently received our first multi-unit order for high-volume manufacturing. This new system will allow our partners to push the boundaries of possibility in PCB manufacturing."
Geode™ G2 laser drilling system utilizes HyperSonix™ technology that shapes laser pulses with sound waves for better throughput and quality. In addition, AcceleDrill™ distributes pulse energy for maximum throughput and allows multiple via sizes in one pass. An industry first for CO2 via drilling, the Beam Characterization Tool (BCT) monitors beam quality and spot health while its automated run-time calibration lowers the cost of ownership.
The Geode™ G2 laser drilling system is available for purchase. More details can be found at www.esi.com, and system experts will be available at the IPC APEX Event, Anaheim, California, April 9-11 in booth 4412.
MKS Instruments enables technologies that transform our world. We deliver foundational technology solutions to leading edge semiconductor manufacturing, electronics and packaging, and specialty industrial applications. We apply our broad science and engineering capabilities to create instruments, subsystems, systems, process control solutions and specialty chemicals technology that improve process performance, optimize productivity and enable unique innovations for many of the world’s leading technology and industrial companies. Our solutions are critical to addressing the challenges of miniaturization and complexity in advanced device manufacturing by enabling increased power, speed, feature enhancement, and optimized connectivity. Our solutions are also critical to addressing ever-increasing performance requirements across a wide array of specialty industrial applications. Additional information can be found at www.mks.com.
Share on:
Suggested Items
indie’s LXM-U Laser Powers Next-Gen Quantum Technologies with Ultra-Low Noise Performance
07/14/2025 | indie Semiconductorindie, an automotive solutions innovator, is rapidly gaining industry adoption in its photonics portfolio, with indie’s latest ultra-low noise LXM-U lasers enabling next-generation quantum applications by delivering industry-leading frequency stability and integration flexibility.
New Podcast Series Launches: Optimize the Interconnect
07/15/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies
06/25/2025 | PRNewswireA new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as on-chip optical communication and neuromorphic computing, which require compact, energy-efficient light sources.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
06/23/2025 | ExcellonExcellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).
The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.