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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Design Community Town Hall Review
April 11, 2024 | Kelly Dack, CID+, EPTACEstimated reading time: 2 minutes
There’s been a lot of work going on at IPC related to PCB design training and education. This week, many new members of IPC’s design groups met up in person at IPC APEX EXPO.
The Design Community Town Hall took place on the afternoon of April 10, 2024. I was fortunate to attend this event, which marked an opportunity for members of some newly found design groups to get together and exchange ideas. Peter Tranitz, senior director of solutions for IPC, opened the session with a slide presentation introducing these new groups and members within the solutions department.
The Design Leadership Council includes 14 members:
Steve Watt (Zuken), Steven Roy (Optimum Design Associates), Dale Lee (Plexus), Pietro Vergine (Leading Edge), Savita Ganjigatti (Sienna ECAD Technologies), Thomas Romant (IPC Designers Council France), Ellefen Jiang (NCAB), Kevin Kusiak (Lockheed Martin), Susan Kayesar (Siemens), Jesus Castane (MBDA), John Watson (Altium), Igor Bulavitchi (Flex), Flayover Guo, and Huseyin Ariac.
The Global IPC Internal Design Team (GIDT) includes 16 members:
Matt Kelly (Sponsor), Mike Milostan (Marketing), Barry Matties (I-Connect007), Andy Shaughnessy (I-Connect007), Carlos Plaza (Education), Teresa Rowe (Standards), Kelly Scanlon (Sustainability), John Perry (Standards), Peter Tranitz (Initiative Coordinator), Patrick Crawford (Standards), Francisco Fourcade (Standards), Andres Ojalill (Standards), Kris Moyer (Education), Lorena Villanueva (Mexico), Shine Yang (China/Asia), and Saurabh Saxena (India).
These new groups are poised to tackle a variety of challenges as IPC pivots to fill gaps in the design and manufacturing knowledge pool due to the ongoing retirement of our senior subject matter experts.
Tranitz then extended “kudos” to these group members. He emphasized that their “1,000 years of combined knowledge” will come in handy as the groups work and collaborate going forward. He emphasized the need to address critically needed updates in educational training programs as well as design and manufacturing standards and guidelines.
The second half of the meeting included a panel discussion moderated by Susan Kayesar, product manager for PCBflow at Siemens. The panel focused on some soon-to-be published white papers on several key design topics involving CAD data, DFM and stakeholder usage and accessibility. The event wrapped up with a rousing Q&A session. PCB designers and design engineers in the audience were not shy about sharing their opinions.
If you’re a subject matter expert on PCB design, consider getting involved with IPC’s design teams. They will welcome you with open arms, and you’ll probably learn something along the way.
Suggested Items
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.
If You Can Define It Right, You Can Design It Right
12/05/2024 | Andy Shaughnessy, Design007Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance. With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.
Cadence, AST SpaceMobile Partner for Global Connectivity
12/04/2024 | Cadence Design SystemsCadence Design Systems, Inc. and AST SpaceMobile, Inc., the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones designed for both commercial and government applications, announced their collaboration to advance AST SpaceMobile’s mission to eliminate connectivity gaps and connect people around the world with high-speed, space-based internet access.
Flex PCB Design Best Practices
12/04/2024 | Brittany Martin, I-Connect007David Lackey, a flex circuit expert at American Standard Circuits, speaks about the advantages and challenges of designing with flexible and rigid-flex PCBs. He also discusses how consulting before the design phase can save time and costs by avoiding manufacturing issues and highlights the reliability and packaging benefits of flex technology, especially for compact designs in sectors like aerospace.