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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Design Community Town Hall Review
April 11, 2024 | Kelly Dack, CID+, EPTACEstimated reading time: 2 minutes
There’s been a lot of work going on at IPC related to PCB design training and education. This week, many new members of IPC’s design groups met up in person at IPC APEX EXPO.
The Design Community Town Hall took place on the afternoon of April 10, 2024. I was fortunate to attend this event, which marked an opportunity for members of some newly found design groups to get together and exchange ideas. Peter Tranitz, senior director of solutions for IPC, opened the session with a slide presentation introducing these new groups and members within the solutions department.
The Design Leadership Council includes 14 members:
Steve Watt (Zuken), Steven Roy (Optimum Design Associates), Dale Lee (Plexus), Pietro Vergine (Leading Edge), Savita Ganjigatti (Sienna ECAD Technologies), Thomas Romant (IPC Designers Council France), Ellefen Jiang (NCAB), Kevin Kusiak (Lockheed Martin), Susan Kayesar (Siemens), Jesus Castane (MBDA), John Watson (Altium), Igor Bulavitchi (Flex), Flayover Guo, and Huseyin Ariac.
The Global IPC Internal Design Team (GIDT) includes 16 members:
Matt Kelly (Sponsor), Mike Milostan (Marketing), Barry Matties (I-Connect007), Andy Shaughnessy (I-Connect007), Carlos Plaza (Education), Teresa Rowe (Standards), Kelly Scanlon (Sustainability), John Perry (Standards), Peter Tranitz (Initiative Coordinator), Patrick Crawford (Standards), Francisco Fourcade (Standards), Andres Ojalill (Standards), Kris Moyer (Education), Lorena Villanueva (Mexico), Shine Yang (China/Asia), and Saurabh Saxena (India).
These new groups are poised to tackle a variety of challenges as IPC pivots to fill gaps in the design and manufacturing knowledge pool due to the ongoing retirement of our senior subject matter experts.
Tranitz then extended “kudos” to these group members. He emphasized that their “1,000 years of combined knowledge” will come in handy as the groups work and collaborate going forward. He emphasized the need to address critically needed updates in educational training programs as well as design and manufacturing standards and guidelines.
The second half of the meeting included a panel discussion moderated by Susan Kayesar, product manager for PCBflow at Siemens. The panel focused on some soon-to-be published white papers on several key design topics involving CAD data, DFM and stakeholder usage and accessibility. The event wrapped up with a rousing Q&A session. PCB designers and design engineers in the audience were not shy about sharing their opinions.
If you’re a subject matter expert on PCB design, consider getting involved with IPC’s design teams. They will welcome you with open arms, and you’ll probably learn something along the way.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.