-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
April 16, 2024 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes

In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. “As an industry partner, we understand the importance of staying at the forefront of market trends. With Innolot MXE, we provide a groundbreaking solution that supports the highest standards of quality and performance” said Ebad Rehman, Product Manager, Solder Paste in the Americas, and Europe.
Advancing Performance with Innolot MXE
Innolot MXE represents a significant breakthrough in reliability, offering enhanced thermomechanical performance to meet the increasing rigorous demands of electronic assemblies. Surpassing traditional options like SAC305 and other high-reliability alternatives, Innolot MXE delivers exceptional thermal cycling, vibration, and drop shock performance. In addition, it achieves high creep-fatigue resistance, through a refined microstructure, making it ideal for the most demanding ruggedized applications. With its unparalleled combination of features, Innolot MXE is ready to usher in the next generation of excellence in electronic assembly.
Driven by Industry Demands
The development of Innolot MXE was inspired by the complex challenges present in sectors spanning automotive, aerospace, high-end computing, and industrial applications, where reliability is critical. Environments with severe stress on solder joints underscore the need for Innolot MXE, as traditional alloy options are limited in performance and durability. This innovative solution offers a higher margin of performance to enhance in-use life and advance board level reliability.
- Innolot MXE addresses new challenges in safety-critical systems, miniaturization, and harsh operating environments, setting a new standard for performance.
- Enhanced Creep Fatigue toughness inhibits crack propagation and improves thermal cycling performance as compared to SAC305 and other high-reliability alloys.
Innolot MXE is Available in ALPHA CVP-390V Solder Paste
To complement its exceptional thermomechanical performance, Innolot MXE is now available in combination with ALPHA CVP-390V solder flux. This offering presents an unparalleled blend of high-performance alloy and solder paste chemistry, ensuring unmatched electrochemical reliability even in the most demanding scenarios.
- ALPHA CVP-390V solder flux provides superior Surface Insulation Resistance (SIR) performance, ensuring reliability in complex assemblies and optimal process capability index (CpK) transfer efficiency, across varying print volumes and area ratios.
Experience ALPHA Innolot MXE, where reliability and performance come together to drive the future of innovation.
Check out these new eBooks from MacDermid Alpha Electronic Solutions:
- The Printed Circuit Assembler's Guide to... ™ Low-temperature Soldering, Vol. 2
- The Printed Circuit Assembler's Guide to... ™ Encapsulating Sustainability for Electronics
For more educational titles, visit the I-007eBooks library.
Suggested Items
Standard of Excellence: Delivering Excellence—A Daily Goal
06/25/2025 | Anaya Vardya -- Column: Standard of ExcellenceDelivering excellence consistently across all touchpoints is essential for organizations aiming to build trust, foster customer loyalty, and maintain their brand reputation. This requires a strategic approach encompassing uniform messaging, standardized service protocols, employee training, performance monitoring, and seamless integration across platforms.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
AMD Acquires Brium to Strengthen Open AI Software Ecosystem
06/05/2025 | AMDAt AMD, we’re committed to building a high-performance, open AI software ecosystem that empowers developers and drives innovation. Today, we’re excited to take another step forward with the acquisition of Brium, a team of world-class compiler and AI software experts with deep expertise in machine learning, AI inference, and performance optimization.