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DuPont to Discuss Development of EUV Photoresists at SPIE Advanced Lithography + Patterning Conference

02/13/2025 | DuPont
DuPont today announced its participation in the 2025 SPIE Advanced Lithography + Patterning conference, taking place Feb. 24–28 in San Jose, California. DuPont will showcase its latest innovations through technical presentations focused on the development of photoresists for extreme ultraviolet (EUV) lithography and advancing sustainability in the design of lithographic materials.

MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics

02/06/2025 | MacDermid Alpha Electronics Solutions
In an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026.

UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2

02/06/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming.

ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at IPC APEX

02/04/2025 | ITW EAE
ITW EAE will be showcasing its latest developments at IPC APEX, March 18 - 20 in Anaheim. The ITW EAE booth #2400 will have MPM, Camalot, Electrovert, Vitronics Soltec and Despatch Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.

Swissbit Unveils PCIe Gen4 SSD A1200

02/04/2025 | Swissbit
Swissbit introduces the latest addition to its PCIe portfolio, the new A1200. The PCIe Gen4 M.2 SSD is designed to meet the demands of high-performance, mission-critical applications, focusing on consistent performance, low latency, and data integrity.
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