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Biden-Harris Administration: CHIPS Incentives Award to TSMC Arizona

11/15/2024 | U.S. Chamber of Commerce
TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Foxconn Posts Q3 2024 Financial Results

11/15/2024 | Foxconn
Revenue reached NT$1.85 trillion, and for the cumulative January-September period revenue totaled NT$4.7 trillion, both setting new highs for the same period compared to previous years.

Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf

11/14/2024 | The Occam Group
The Occam Group, developers of an innovative advanced electronics manufacturing methodology announced the addition of Dana Korf (Korf Consultancy) to its leadership team. Korf, a seasoned PCB professional, will play a pivotal role in driving innovation and expanding Occam’s capabilities for the electronics industry.

Biden-Harris Administration: Akash Systems to Support Emerging Semiconductor Technology

11/14/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the CHIPS and Science Act.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2

11/14/2024 | I-Connect007 Editorial Team
The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter discusses panelization, placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.
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