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Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
May 17, 2024 | Indium CorporationEstimated reading time: 1 minute
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany. Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and drive green technologies of tomorrow, such as e-Mobility. These proven materials have also been shown to solve customers’ warpage issues while ensuring high reliability and improving overall efficiency.
Among its featured products, Indium Corporation will showcase:
- Durafuse® HT – an innovative Pb-free solution based on a novel alloy technology designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
- Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents delamination and warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS®.
- QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. Applications include die-attach and substrate-attach in power electronics. The portfolio includes the InFORCE™ range of pressure sinter pastes:
- InFORCE™29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications; InFORCE™29 features high workability, making it suitable for printing or dispensing applications.
- InFORCE™MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications; InFORCE™MF is specially formulated for printing applications, providing low process yield loss due to print defects.
- InFORCE™ LA – a pressure silver sinter paste formulated for sintering of areas greater than 100mm2. Sintering is possible with reduced temperatures and pressure, making it suitable for transferring molded package-attach to cooler applications.
To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #466.
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08/20/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming NEPCON Vietnam taking place September 11-13 at I.C.E. Hanoi, Vietnam.
Indium Corporation Introduces Au-Based Precision Die-Attach Preforms
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Indium Corporation Expert to Present at High-Temperature Electronics Network Conference
06/18/2024 | Indium CorporationIndium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place July 15-17 in Edinburgh, Scotland, United Kingdom.
Indium to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium
06/05/2024 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.