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Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
May 17, 2024 | Indium CorporationEstimated reading time: 1 minute
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany. Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and drive green technologies of tomorrow, such as e-Mobility. These proven materials have also been shown to solve customers’ warpage issues while ensuring high reliability and improving overall efficiency.
Among its featured products, Indium Corporation will showcase:
- Durafuse® HT – an innovative Pb-free solution based on a novel alloy technology designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
- Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents delamination and warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS®.
- QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. Applications include die-attach and substrate-attach in power electronics. The portfolio includes the InFORCE™ range of pressure sinter pastes:
- InFORCE™29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications; InFORCE™29 features high workability, making it suitable for printing or dispensing applications.
- InFORCE™MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications; InFORCE™MF is specially formulated for printing applications, providing low process yield loss due to print defects.
- InFORCE™ LA – a pressure silver sinter paste formulated for sintering of areas greater than 100mm2. Sintering is possible with reduced temperatures and pressure, making it suitable for transferring molded package-attach to cooler applications.
To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #466.
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Indium to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium
06/05/2024 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
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Design Guidelines for Flexible Printed Circuits
02/15/2024 | Chris Keirstead, PFC Flexible CircuitsAn important but sometimes overlooked aspect of flex and rigid-flex fabrication and assembly is the flex circuit tail, which is attached to a rigid PCB with pressure-sensitive conductive adhesives. This sub-assembly is becoming very common. We often see this applied to glass displays and microelectronic applications.
Indium to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
01/12/2024 | Indium CorporationIndium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco.
Curtiss-Wright Awarded $34M Contract to Provide Airborne Data Recorder Technology to the U.S. Navy
10/06/2023 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been awarded a five-year, $34 million firm-fixed-price indefinite delivery, indefinite quantity (IDIQ) contract by the Naval Surface Warfare Center (NSWC) to provide Modular Open Systems Approach (MOSA) based airborne data recorder technology for use on U.S. and Australian manned and unmanned maritime aircraft.