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Inventec Performance Chemicals and Nano-Join are Teaming Up to Deliver Sintering Solutions

11/08/2024 | SMTA
With great excitement we announce to have signed a license agreement with NANO-JOIN GmbH to use their sintering technology and integrate it into our ECORELTM SINTEC product line.

Indium Experts to Present at International Electronics Manufacturing Technology Conference

10/15/2024 | Indium Corporation
Indium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia.

AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at NEPCON Vietnam

08/20/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming NEPCON Vietnam taking place September 11-13 at I.C.E. Hanoi, Vietnam.

Indium Corporation Introduces Au-Based Precision Die-Attach Preforms

07/17/2024 | Indium Corporation
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.

Indium Corporation Expert to Present at High-Temperature Electronics Network Conference

06/18/2024 | Indium Corporation
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place July 15-17 in Edinburgh, Scotland, United Kingdom.
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