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Listen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers
May 24, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is thrilled to announce the release of the latest episode in Series 3 of its popular podcast, On the Line With... , available now on Apple and Spotify.
In “PCB 3.0: A New Design Methodology—More Power to the EE,” we continue the theme of bringing more decision-making power to the design process. This time, we're discussing how to bring more "power" (and "signal”) to the electrical engineer with our guest, Supreeth Mannava, Cadence Design Systems.
What should manufacturers know? What does this mean for EEs and the new generation of designers? Listen to find out!
I-Connect007 is dedicated to providing our audience with a wide range of digital content and information to help them succeed in the industry. From magazines, books, and newsletters to market reports, podcasts, and event coverage, we deliver digital content that meets the needs of our community.
I-Connect007 is the longest-running digital media company in the industry and a leading publisher of original, exclusive content for the global electronics supply chain.
Listen now to Episodes 1-5 of PCB 3.0: A New Design Methodology.
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Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
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IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.