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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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Listen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers
May 24, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is thrilled to announce the release of the latest episode in Series 3 of its popular podcast, On the Line With... , available now on Apple and Spotify.
In “PCB 3.0: A New Design Methodology—More Power to the EE,” we continue the theme of bringing more decision-making power to the design process. This time, we're discussing how to bring more "power" (and "signal”) to the electrical engineer with our guest, Supreeth Mannava, Cadence Design Systems.
What should manufacturers know? What does this mean for EEs and the new generation of designers? Listen to find out!
I-Connect007 is dedicated to providing our audience with a wide range of digital content and information to help them succeed in the industry. From magazines, books, and newsletters to market reports, podcasts, and event coverage, we deliver digital content that meets the needs of our community.
I-Connect007 is the longest-running digital media company in the industry and a leading publisher of original, exclusive content for the global electronics supply chain.
Listen now to Episodes 1-5 of PCB 3.0: A New Design Methodology.
Suggested Items
Aismalibar to Showcase Thermal Management Solutions for EV Battery Systems at The Battery Show North America 2024
09/27/2024 | AismalibarAismalibar, a leader in innovative thermal management materials, will be presenting its newest solutions for electric vehicle (EV) battery systems at The Battery Show North America from October 7-11, 2024. Located at Huntington Place, Detroit, MI, Aismalibar will exhibit at booth 6231, unveiling a range of cutting-edge Thermal Interface Materials (TIMs) designed to improve the safety, performance, and longevity of EV batteries.
TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design
09/27/2024 | ANSYSAnsys and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies.
Silicon to Systems: A Wake-up Call for the Industry
09/26/2024 | Andy Shaughnessy, Design007 MagazineDuane Benson, founder of Positive Edge, has been working with silicon and packaging for longer than some of our newer readers have been alive. We asked him to share his thoughts on silicon to systems, which Duane says is much more than a buzzword—it’s a wake-up call for the industry.
Connect the Dots: Designing for Reality: Outer Layer Imaging
09/26/2024 | Matt Stevenson -- Column: Connect the DotsWelcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.
Siemens Extends Collaboration with TSMC to Advance Integrated Circuit and Systems Design
09/25/2024 | SiemensSiemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications and innovative technology enablement for the foundry’s newest process technologies.