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EIPC 2025 Winter Conference, Day 1: From Manufacturing to Sustainability

02/19/2025 | Pete Starkey, I-Connect007
The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days conference proceedings. This is my report of the first day’s conference proceedings. The keynote session and second-day conference proceedings are reported separately.

UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2

12/23/2024 | Anaya Vardya, American Standard Circuits
​​​​​​​Ultra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/20/2024 | Nolan Johnson, I-Connect007
Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week. 

Offshore Sourcing in the Global Supply Chain

11/20/2024 | Brittany Martin, I-Connect007
​​​​​​​Bob Duke, president of the Global Sourcing Division at American Standard Circuits, discusses the challenges and benefits of navigating the global supply chain, including the value of strong supplier relationships, rigorous quality control, and strategic sourcing from regions including China, Vietnam, and India.

Understanding Cleaning Challenges for Automated Solder Paste Dispensing

09/18/2024 | Debbie Carboni, KYZEN
In today’s rapidly evolving electronics manufacturing landscape, staying abreast of innovative technologies is crucial. As solder paste and substrate materials continually evolve and become more complex, optimizing production methods with the latest technology ensures performance and quality while reducing operational costs.
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